Large-power light-emitting diode (LED) heat dissipation mechanism

A heat dissipation mechanism and high-power technology, applied in lighting and heating equipment, cooling/heating devices of lighting devices, lighting devices, etc., can solve the problems of transmission, low cost of substrates that cannot use small area and large heat, and achieve flexible and convenient installation , Improve thermal conductivity and reliability, reduce weight and cost

Inactive Publication Date: 2013-04-24
杨同彦
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0007] The purpose of the present invention is to provide a heat dissipation mechanism to solve the problem in the existing LED heat dissipation technology that the heat of the substrate with small area and large heat cannot be transferred to the air heat dissipation surface at low cost and reliable low thermal resistance

Method used

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  • Large-power light-emitting diode (LED) heat dissipation mechanism
  • Large-power light-emitting diode (LED) heat dissipation mechanism
  • Large-power light-emitting diode (LED) heat dissipation mechanism

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Embodiment Construction

[0019] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific implementation examples described here are only used to explain the present invention, and are not intended to limit the present invention.

[0020] The implementation of the present invention is to use the LED substrate as the bottom plate of the evaporator, reduce the heat transfer path, reduce the thermal resistance, and improve the reliability; utilize the characteristics of large water vaporization heat, strong fluidity, and low water vapor heat transfer thermal resistance, and the Small area and large amount of heat are transferred to the inner surface of the large-area and thin-shell heat-dissipating condenser. Reducing the thermal conductivity of the heat-dissipating material requires maintaining low t...

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Abstract

The invention provides a large-power light-emitting diode (LED) heat dissipation mechanism comprising an evaporator, two guide pipes, an air convection heat dissipation condenser and water, wherein the evaporator is connected with the condenser through the two guide pipes, and the bottom of the evaporator is an insulated and heat-conductive LED substrate. The heat dissipation mechanism provides a low-cost solution which is light in weight, simple and reliable in structure and high in heat-conductive and heat dissipation efficiency for large-power LED application, particularly integrated large-power LED application.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation, and in particular relates to the application of high-power LEDs; for example, the heat dissipation treatment technology for applications such as street lamps and car headlights. Background technique [0002] As a new high-efficiency and environmentally friendly light source, LED will soon replace the existing incandescent lamp and gas light-emitting lamp, and become one of the main light sources in the future. At this stage, the energy converted into light output by LED only accounts for 30% and 70% of the input energy. It is converted into heat, and the heat of the chip is mainly dissipated in the form of heat transfer; the heat dissipation problem is one of the keys to whether the LED can work efficiently and stably. Good heat dissipation, low chip temperature, high luminous efficiency, more stable and reliable, and longer life; on the contrary On the contrary. Especially the applicat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V29/00F21Y101/02F21V29/503F21V29/51F21V29/74
Inventor 杨同彦
Owner 杨同彦
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