Large flexible printed circuit (FPC) and typesetting method of manufacturing FPC

A technology of layout and dislocation distribution, used in the structural connection of printed circuits, printed circuit components, and electrical components to assemble printed circuits, etc., can solve problems such as FPC damage, reduce waste, reduce damage, and reduce The effect of damage ratio

Active Publication Date: 2013-04-24
EELY ECW TECH
View PDF8 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The thickness of the FPC (Flexible Printed Circuit, flexible printed circuit board) single-sided plate is only about 70μ. In the production process, in order to simplify the process of gold plating, bonding and reinforcement and improve the production efficiency, several FPC units are often arranged on large sheets of material. First, after completing various processes, use the punching machine to blank the large FPC, and punch out the FPC unit whose shape meets the subsequent process requirements, such as figure 1 As shown, the existing large FPC typesetting method is a flush typesetting method in which the top of the FPC unit is aligned. For example, the patent application number is: the typesetting method of the FPC in CN200510022341.X. When the FPC unit length is long, due to its thin thickness, Due to the soft material, large FPCs are likely to be damaged during operations such as gold plating, reinforcement, punching, etc.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Large flexible printed circuit (FPC) and typesetting method of manufacturing FPC
  • Large flexible printed circuit (FPC) and typesetting method of manufacturing FPC
  • Large flexible printed circuit (FPC) and typesetting method of manufacturing FPC

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] Embodiments of the present invention are described in detail below:

[0028] like figure 2 As shown, a large FPC1 includes several FPC units 2 arranged thereon; the several FPC units 2 are misplaced on the layout of the large FPC1.

[0029] After staggering the layout of FPC unit 2, the generated stress is dispersed, the stress intensity becomes smaller, and the proportion of fractures is reduced. Both the large-sheet FPC1 production process and the large-sheet FPC1 blanking process increase the yield rate. The FPC with a length of 72.5 mm and a model number of GITO.6370 as described in the embodiment is taken as an example. The yield rate has increased from about 65% to over 80%, mainly because the defective rate of damage during the operation has been controlled.

[0030] The FPC units 2 are arranged in the same direction. Compared with the random typesetting method, this typesetting method can arrange as many FPC units 2 as possible on the layout of the same area....

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a large flexible printed circuit (FPC) and belongs to the technical field of flexible printed circuit manufacture. The FPC comprises a plurality of FPC units arranged on the FPC and the plurality of FPC units are arranged in a staggered mode on the large FPC page. The invention further discloses a typeset method of manufacturing the FPC. The plurality of FPC units are arranged in the staggered mode on the large FPC page. According to staggered arrangement of the FPC units, stress generated is dispersed so that stress intensity is lessened, a bending ratio is reduced and yield in the process of the large FPC manufacturing and large FPC blanking is improved. The typeset method of manufacturing the FPC can be used in the manufacturing process of the FPC.

Description

technical field [0001] The invention relates to a flexible printed circuit board, in particular to a large flexible printed circuit board and a typesetting method for making FPC. Background technique [0002] The thickness of the FPC (Flexible Printed Circuit, flexible printed circuit board) single-sided plate is only about 70μ. In the production process, in order to simplify the process of gold plating, bonding and reinforcement and improve the production efficiency, several FPC units are often arranged on large sheets of material. First, after completing various processes, use the punching machine to blank the large FPC, and punch out the FPC unit whose shape meets the subsequent process requirements, such as figure 1 As shown, the existing large FPC typesetting method is a flush typesetting method in which the top of the FPC unit is aligned. For example, the patent application number is: the typesetting method of the FPC in CN200510022341.X. When the FPC unit length is lo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/14H05K3/36
Inventor 曾丹
Owner EELY ECW TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products