Electroplating method for circuit board of precise circuit

Abstract

The invention discloses an electroplating method for a circuit board of a precise circuit. The electroplating method comprises the following steps of part number selecting, forward board arranging, current setting, forward electroplating, reverse board arranging, current setting and electroplating completing, wherein the current setting includes that an arranged circuit board current-conducting plate is adjusted into an electroplating cylinder, current density is set, the current density is set to be one half of the current density of the pre-set demand for completing copper thickness, and time remains unchanged, and after the electroplating time is completed, the circuit board is taken down from a current-conducting plate, and a next process is conducted continuously. The electroplating method for the circuit board of the precise circuit uses the circuit board of the high-precision level circuit which is manufactured with a traditional gantry type electroplating wire, and therefore copper thickness uniformity difference can be controlled within 6 um, and the control demands of manufacturing the high-precision circuit level copper thickness of and below 3mil / 3mil are satisfied.

Description

technical field [0001] The invention relates to an electroplating method for a circuit board, in particular to an electroplating method for a circuit board with high-precision circuits with small uniformity of copper thickness, and belongs to the technical field of circuit board processing. Background technique [0002] With the development of electronic products in the direction of lightness, thinness, shortness and smallness, the wiring density of circuit boards is increasing day by day, and the level of lines (line width / line) is also becoming smaller and smaller. At present, the level of precision lines has been raised to 2mil / 2mil level This brings new challenges to the electroplating of circuit boards, because in the production of fine lines, the copper thickness of the circuit plays an important role. If the surface copper thickness of the electroplated circuit board is different If it is too large, when etching fine lines, the lines in some parts are often not etched...

AI Technical Summary

Problems solved by technology

[0002] With the development of electronic products in the direction of lightness, thinness, shortness and smallness, the wiring density of circuit boards is increasing day by day, and the level of lines (line width / line) is also becoming smaller and smaller. At present, the level of precision lines has been raised to 2mil / 2mil level This brings new challenges to the electroplating of circuit boards, because in the production of fine lines, the copper thickness of the circuit plays an important role. If the surface copper thickness of the electroplated circuit board is different If it is too large, when etching fine lines, the lines in some parts are not etched out, and the lines in other positions have been etched too much, which will eventually cause the entire board to be unqualified. line key

The traditional gantry-type electroplating line has become the first choice for circuit board suppliers due to its high output and low cost, but its design has the reality that the upper and lower power lines are unevenly distributed during electroplating, so there is too much difference in the uniformity of electroplating. The defects of the circuit boards often have a uniform thickness difference of more than 10um after the completion of one electroplating, which has also become a bottleneck for the development of circuit boards to high-end. The demand for precision circuit production is the key to solving the above problems