Tool and process for spot welding of loudspeaker frame
A speaker basin and spot welding technology, applied in auxiliary devices, manufacturing tools, welding equipment and other directions, can solve the problems of pollution, tin slag splash pollution, etc., and achieve the effect of reducing work intensity and improving production efficiency
Active Publication Date: 2013-05-01
BESTAR HLDG
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Problems solved by technology
[0003] Aiming at the problem of tin slag splashing polluting products in the above-mentioned technical problems, the present invention provides a kind of loudspeaker frame spot welding tooling and spot welding process, which can prevent solder wire frying tin from splashing on the speaker frame during spot welding, avoiding Eliminate the pollution of tin slag to the speaker frame
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[0025] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.
[0026] see figure 1 , 2 , 3. Spot welding tooling for the speaker pot frame, including a base plate 1 and a cover plate 2 covering the base plate, forming a plurality of limiting spaces between the base plate and the cover plate, and opening a plurality of spacers on the upper surface of the base plate. The downward surface is recessed for accommodating the positioning groove 4 of the speaker basin frame 3. The shape of the positioning groove is the same as that of the speaker basin frame. The size of the outer peripheral wall of the speaker basin frame is equal to or slightly smaller than the size of the positioning groove. There is a limit block 5 protruding toward the middle of the positioning groove, and the limit block 5 cooperates with the notch 6 arranged on the speaker basin frame;
[0027] The lower surface of the cover plate 2 is pr...
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The invention discloses a tool and a process for the spot welding of a loudspeaker frame. The tool comprises a substrate, a cover plate, a plurality of limiting spaces, a plurality of positioning slots, and limiting blocks, wherein the cover plate covers on the substrate, the limiting spaces are formed between the substrate and the cover plate, the positioning slots are formed in the upper surface of the substrate, sink from the upper surface of the substrate to the lower surface of the substrate and are used for accommodating the loudspeaker frame, the positioning slots are identical to the loudspeaker frame in shape, and the limiting blocks are arranged on the inner walls of the positioning slots, protrude towards the middles of the positioning slots and are matched with notches formed in the loudspeaker frame; and the lower surface of the cover plate is provided with accommodating slots and spot-welding evasion through holes, the accommodating slots are in one-to-one correspondence to the positioning slots in the substrate, the spot-welding evasion through holes are formed in one sides of the accommodating slots and are communicated with the positioning slots, and after the substrate and the cover plate are combined in place, the positioning slots and the accommodating slots form the limiting spaces, the loudspeaker frame is located in the limiting spaces, and spot-welding parts on the loudspeaker frame are located in the spot-welding evasion through holes. During spot welding, solder wires can be prevented from being subjected to solder explosion and splashed to the loudspeaker frame, and thus, the pollution of solder spatters to the loudspeaker frame is avoided.
Description
technical field [0001] The invention relates to the technical field of loudspeaker production, in particular to a loudspeaker frame, and more particularly to a spot welding tool and a spot welding process for a speaker frame. Background technique [0002] When the spot welding machine is spot welding, when the solder wire is heated at high temperature, the solder will explode with the rosin in the tin wire and splash onto the product, causing tin slag pollution of the product. There are two ways to prevent the solder wire from frying tin. Use silver-containing lead-free solder wire, and the price of silver-containing lead-free solder wire is twice the price of ordinary lead-free solder wire, resulting in an increase in material costs; the second is to use a tin wire punching machine to punch holes in the tin wire, and the tin wire There are holes on the surface, and when the solder wire is heated at high temperature, the rosin will volatilize from the surface of the holes, b...
Claims
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Login to View More IPC IPC(8): B23K11/36B23K37/04
Inventor 邱蒙蒙姚利明张秀琴吴逸飞
Owner BESTAR HLDG