Graphite die for sintering multichip

Abstract

The invention discloses a graphite die for sintering a multichip. The graphite die comprises a graphite bottom plate (1) and a graphite assembling strip (2); a sintering groove (3) with an opening is formed on the side part of the graphite assembling strip (2); the sintering groove (3) comprises a sintering chamber (4), an upper sintering groove (5) and a lower sintering groove (6), wherein the upper sintering groove (5) and the lower sintering groove (6) are formed on the upper side and the lower side of the sintering chamber (4) and are communicated with the sintering chamber (4); the dimension of the sintering chamber (4) in the length direction and the width direction of the graphite assembling strip (2) is smaller than the dimensions of the upper sintering groove (5) and the lower sintering groove (6) along the length direction and the width direction of the graphite assembling strip (2). According to the graphite die for sintering the multichip, disclosed by the invention, the structure of each part of the upper sintering groove of the graphite assembling strip is designed according to the structure of a design product, so that the chip in each position can be matched with different positions on the sintering grooves, and the chips can be prevented from collapsing during being assembled and sintered; and the graphite die has the characteristics of being simple in structure and convenient to use, and is suitable for popularization and application.

Description

technical field [0001] The invention relates to a graphite mold for encapsulation and sintering, in particular to a graphite mold for multi-chip sintering which can realize assembly and fixing of multi-layer chips. Background technique [0002] At present, the known graphite mold is composed of a graphite assembly strip with a single hole or a porous single-layer structure and a graphite base plate. Simply assemble the packaged chips and solder pads together and fix them. However, the assembly of multi-chips cannot be assembled and fixed by traditional graphite molds. Generally, graphite molds cannot play the role of fixing the position of chips in the assembly of multi-layer chips, and the assembly process is quite difficult, which may easily cause multi-layer chips in the assembly process. Collapse in the medium and lead to low sintering pass rate. Contents of the invention [0003] The object of the present invention is to provide a graphite mold for multi-chip sinte...

AI Technical Summary

Problems solved by technology

However, the assembly of multi-chips cannot be assembled and fixed by traditional graphite molds. Generally, graphite molds cannot play the role of fixing the position of chips in the assembly of multi-layer chips, and the assembly process is quite difficult, which may easily cause multi-layer chips in the assembly process. Collapse in middle and lead to low sintering pass rate

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