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Bump wire direct attach structure in package

A technology for packaging components and packaging substrates, which can be used in electrical components, electrical solid-state devices, semiconductor devices, etc., and can solve problems such as peeling

Active Publication Date: 2016-01-20
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This stress is applied over the metal traces in the BOT structure, causing the metal lines to delaminate from the dielectric layer in the adjacent package substrate

Method used

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  • Bump wire direct attach structure in package
  • Bump wire direct attach structure in package
  • Bump wire direct attach structure in package

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Embodiment Construction

[0029] The making and using of embodiments of the invention are discussed in detail below. It should be appreciated, however, that the embodiments provide many applicable inventive concepts that can be implemented in a wide variety of specific contexts. The specific embodiments discussed are exemplary only, and do not limit the scope of the invention.

[0030] The package structure includes a bump-to-wire (BOT) structure, and anchor vias may be provided according to various embodiments. Variations of the embodiments are discussed. Like numerals are used to designate like elements throughout the various drawings and descriptive embodiments.

[0031] figure 1 A cross-sectional view of a package according to an embodiment is shown. The package includes a package component 100 and a package component 200 bonded to the package component 100 . Package component 100 may be a device die having active devices therein, such as transistors (shown as 104 in the figure), but package c...

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PUM

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Abstract

A package component includes a metal trace located above a top surface of the package component and an anchor via located below and in contact with the metal trace. The anchor vias are configured not to conduct current flowing through the metal traces. The invention also provides the direct connection structure of bump wires in the package.

Description

technical field [0001] The present invention generally relates to the field of semiconductor technology, and more specifically, relates to a package. Background technique [0002] Bump-on-wire (BOT) configurations are used in flip-chip packages where metal bumps are bonded directly to narrower metal traces in the package substrate rather than to metal pads, which The pads have a greater width than the metal traces to which they are connected. The BOT structure requires a smaller chip area, and the manufacturing cost of the BOT structure is lower. The BOT structure can achieve the same reliability as conventional bonding structures based on metal pads. [0003] Occasionally, the BOT structure may peel off. For example, when a device die is bonded to a packaging substrate via a BOT structure, stress can be induced in the resulting package due to a significant mismatch between the coefficient of thermal expansion (CTE) of the device die and the CTE of the packaging substrate...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/48H01L23/488
CPCH01L23/49827H01L24/13H01L24/16H01L2224/13014H01L2224/13082H01L2224/131H01L2224/81191H01L2224/81385H01L2224/16238H01L2224/73204H01L23/49816H01L23/49822H01L2924/01322H01L2224/16013H01L2924/00014H01L2924/00012H01L2924/014H01L2924/00
Inventor 陈志华
Owner TAIWAN SEMICON MFG CO LTD