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Electroluminescence device and its preparation method

An electroluminescent device and lithography technology, which is applied in the fields of electro-solid devices, semiconductor/solid-state device manufacturing, electrical components, etc., can solve the problem that the transmission rate of electron transport materials is not ideal, cannot effectively improve the probability of exciton recombination, and increase the resistance. And other issues

Active Publication Date: 2016-09-07
OCEANS KING LIGHTING SCI&TECH CO LTD +1
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  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In traditional light-emitting devices, since the transport rate of electrons is two orders of magnitude lower than that of holes (the hole transport rate is generally 10 -3 cm 2 V -1 S -1 , the electron transfer rate is generally 10 -5 cm 2 V -1 S -1 ), this difference in rate often leads to a low probability of exciton recombination. At the same time, the current electron injection layer used in organic electroluminescence is generally LiF, and if the film thickness of this material is too thick, the resistance will rise sharply, and if it is too thin, the resistance will increase sharply. It will not play a buffer role, and eventually the efficiency of the device will decrease. In addition, if the thickness is too thin, the distance between the active layer and the metal cathode will be too close, which will cause electronic quenching and affect the energy conversion efficiency. At the same time, the evaporation of LiF The plating temperature is about 800-1000 degrees, which will cause the degassing process of the vacuum equipment during the evaporation process, so that the vacuum degree will suddenly rise, and impurities will be introduced, which is not conducive to evaporation. At the same time, the transmission rate of most electron transport materials is not ideal. , which is quite different from the hole transport rate, and cannot effectively improve the recombination probability of excitons

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  • Electroluminescence device and its preparation method
  • Electroluminescence device and its preparation method
  • Electroluminescence device and its preparation method

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preparation example Construction

[0036] see figure 2 , the manufacturing method of the electroluminescent device 100 in one embodiment includes the following steps.

[0037] Step S110 , performing pretreatment on the substrate 10 .

[0038] Specifically, firstly, the glass substrate 10 is subjected to photolithography treatment, cut into a required size, and then ultrasonically cleaned with detergent, deionized water, acetone, ethanol and isopropanol for 15 minutes.

[0039] Step S120 , evaporating the metal cathode 20 on the substrate 10 .

[0040] The material of the metal cathode 20 may be aluminum (Al), silver (Ag), gold (Au) or platinum (Pt), preferably Ag. The thickness of the metal cathode 20 is 10-40 nm, preferably 15 nm.

[0041] Step S130 , using magnetron sputtering or electron beam evaporation to deposit the electron transport layer 30 on the metal cathode 20 . The material of the electron transport layer 30 is a low-valence metal compound doped with a high-valence metal oxide, the high-valen...

Embodiment 1

[0048] The electroluminescent device structure of the present embodiment 1:

[0049] Glass / Ag / WO 3 :TiO 2 / TPBi / Alq 3 / TAPC / NPB / MoO 3 / Ag.

[0050] The preparation process of the electroluminescent device of this embodiment 1 is as follows:

[0051] Firstly, the glass substrate is subjected to photolithography treatment, cut into the required size, and then ultrasonically cleaned with detergent, deionized water, acetone, ethanol and isopropanol for 15 minutes. Then the cathode layer is evaporated, the material is Ag, and the thickness is 15nm. Then the electron transport layer is prepared by electron beam evaporation, and the low-valence metal compound is TiO 2 , the high-valence metal oxide is WO 3 , WO 3 The doping mass percentage is 6%, and the thickness is 60nm. Then the electron beam evaporates the hole blocking layer, the material is TPBi, and the thickness is 5nm; the light-emitting layer, the material is Alq 3 , the thickness is preferably 30nm; the electron ...

Embodiment 2

[0055] The electroluminescent device structure of the present embodiment 2:

[0056] Glass / Al / V 2 o 5 :CdS / TAZ / TCTA:FIrpic / TCTA / TAPC / WO 3 / Al.

[0057] The preparation process of the electroluminescent device of this embodiment 2 is as follows:

[0058] First, the glass substrate is subjected to photolithography treatment, cut into the required size, and then ultrasonically cleaned with detergent, deionized water, acetone, ethanol and isopropanol for 15 minutes; the cathode layer is evaporated, the material is Al, and the thickness is 10nm , and then magnetron sputtering to prepare the electron transport layer, the low-valence metal compound is CdS, and the high-valence metal oxide is V 2 o 5 , the doping mass percentage example is 2%, and the thickness is 100nm; then the hole blocking layer is evaporated, and the material is TAZ, and the thickness is 10nm; the light-emitting layer, the material is TCTA:FIrpic, the doping mass percentage example is 20%, and the thickness ...

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Abstract

The invention relates to an electroluminescence device and a manufacturing method thereof. The electroluminescence device comprises a substrate, a metal negative electrode, an electron transmission layer, a hole barrier layer, a luminescent layer, an electron barrier layer, a hole transmission layer, a hole injection layer and a metal positive electrode which are all laminated in sequence, wherein the electron transmission layer is made of low price state metallic compounds mixed with high price state metallic compounds, the high price state metallic compounds are molybdenum trioxide or vanadium pentoxide or tungsten trioxide, and the low price state metallic compounds are titanium dioxide or cadmium sulfide or cadmium selenide. According to the electroluminescence device, through manufacturing of the n-type electron transmission layer mixed with inorganic materials, high price state metallic oxide is doped into lower price state metallic compound materials, and thus exciton composition probability is improved and luminous efficiency is strengthened.

Description

【Technical field】 [0001] The invention relates to a bottom emission electroluminescence device and a preparation method thereof. 【Background technique】 [0002] In 1987, C.W.Tang and Van Slyke of Eastman Kodak Company in the United States reported a breakthrough in the research of organic electroluminescence. A high-brightness, high-efficiency double-layer small-molecule electroluminescent device was prepared using ultra-thin film technology. In this double-layer structure device, the brightness reaches 1000cd / m at 10V 2 , its luminous efficiency is 1.51lm / W, and its lifespan is more than 100 hours. In 1990, Burronghes et al. of the University of Cambridge proposed for the first time to use polymer conjugated polymer polyphenylene vinylene (PPV) to make polymer electroluminescence (EL) devices. Subsequently, the experimental group led by Professor Heeger of the University of California in the United States In 1991, the electroluminescent properties of polymers were furthe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/50H01L51/54
Inventor 周明杰王平黄辉张振华
Owner OCEANS KING LIGHTING SCI&TECH CO LTD