Electroluminescence device and its preparation method
An electroluminescent device and lithography technology, which is applied in the fields of electro-solid devices, semiconductor/solid-state device manufacturing, electrical components, etc., can solve the problem that the transmission rate of electron transport materials is not ideal, cannot effectively improve the probability of exciton recombination, and increase the resistance. And other issues
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[0036] see figure 2 , the manufacturing method of the electroluminescent device 100 in one embodiment includes the following steps.
[0037] Step S110 , performing pretreatment on the substrate 10 .
[0038] Specifically, firstly, the glass substrate 10 is subjected to photolithography treatment, cut into a required size, and then ultrasonically cleaned with detergent, deionized water, acetone, ethanol and isopropanol for 15 minutes.
[0039] Step S120 , evaporating the metal cathode 20 on the substrate 10 .
[0040] The material of the metal cathode 20 may be aluminum (Al), silver (Ag), gold (Au) or platinum (Pt), preferably Ag. The thickness of the metal cathode 20 is 10-40 nm, preferably 15 nm.
[0041] Step S130 , using magnetron sputtering or electron beam evaporation to deposit the electron transport layer 30 on the metal cathode 20 . The material of the electron transport layer 30 is a low-valence metal compound doped with a high-valence metal oxide, the high-valen...
Embodiment 1
[0048] The electroluminescent device structure of the present embodiment 1:
[0049] Glass / Ag / WO 3 :TiO 2 / TPBi / Alq 3 / TAPC / NPB / MoO 3 / Ag.
[0050] The preparation process of the electroluminescent device of this embodiment 1 is as follows:
[0051] Firstly, the glass substrate is subjected to photolithography treatment, cut into the required size, and then ultrasonically cleaned with detergent, deionized water, acetone, ethanol and isopropanol for 15 minutes. Then the cathode layer is evaporated, the material is Ag, and the thickness is 15nm. Then the electron transport layer is prepared by electron beam evaporation, and the low-valence metal compound is TiO 2 , the high-valence metal oxide is WO 3 , WO 3 The doping mass percentage is 6%, and the thickness is 60nm. Then the electron beam evaporates the hole blocking layer, the material is TPBi, and the thickness is 5nm; the light-emitting layer, the material is Alq 3 , the thickness is preferably 30nm; the electron ...
Embodiment 2
[0055] The electroluminescent device structure of the present embodiment 2:
[0056] Glass / Al / V 2 o 5 :CdS / TAZ / TCTA:FIrpic / TCTA / TAPC / WO 3 / Al.
[0057] The preparation process of the electroluminescent device of this embodiment 2 is as follows:
[0058] First, the glass substrate is subjected to photolithography treatment, cut into the required size, and then ultrasonically cleaned with detergent, deionized water, acetone, ethanol and isopropanol for 15 minutes; the cathode layer is evaporated, the material is Al, and the thickness is 10nm , and then magnetron sputtering to prepare the electron transport layer, the low-valence metal compound is CdS, and the high-valence metal oxide is V 2 o 5 , the doping mass percentage example is 2%, and the thickness is 100nm; then the hole blocking layer is evaporated, and the material is TAZ, and the thickness is 10nm; the light-emitting layer, the material is TCTA:FIrpic, the doping mass percentage example is 20%, and the thickness ...
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