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247results about How to "Increase chance of compounding" patented technology

Fused ring compound as well as preparation method and application thereof

The invention discloses a fused ring compound comprising a structure shown as a formula (I) or (II). According to the fused ring compound, by controlling effective conjugation of aromatic rings and heterocyclic rings, the electron transport performance is balanced while the hole performance is improved. The compound has high triplet state energy level and glass transition temperature, is difficultin crystallization of material molecules, and is capable of ensuring high-efficiency transfer of energy to a guest material while serving as a host material of a luminous layer. The substituent groupof the fused ring compound is adjusted, the electron and hole transport performances are further improved, the singlet state and triplet state energy level difference is reduced, the compound area ofthe carrier is widened, and triplet state exciton annihilation is avoided. The invention further discloses an organic electroluminescence device. At least one functional layer contains the fused ringcompound, and the fused ring compound serves as the host material of the luminous layer and is matched with the energy level of an adjacent carrier transport layer. The luminous efficiency of the device is improved, and the driving voltage of the device is reduced.
Owner:NINGBO LUMILAN NEW MATERIAL CO LTD

Fused ring compound as well as preparation method and purpose thereof

The invention discloses a fused ring compound, which has a structure shown as a formula (I) or a formula (II). The effective conjugation of aromatic rings and heterocyclic rings is controlled in the fused ring compound; the hole performance is improved; meanwhile, the electronic transmission performance is favorably balanced; the compound has high triplet state energy level and glass transition temperature; material molecules cannot easily crystallize; when the fused ring compound is used as a luminescent layer host material, the efficient transfer of energy to guest materials can be guaranteed. The substituent group of the fused ring compound is regulated, so that the electron and hole transmission performance is further improved; the singlet state and triplet state energy level difference is reduced; the compound region of carriers is expanded; the triplet state exciton annihilation is prevented. The invention also discloses an organic electroluminescence device; at least one function layer contains the fused ring compound; the fused ring compound is used as the host material of the luminescent layer and is matched with the adjacent carrier transmission layer energy level; the luminous efficiency of the device is improved; meanwhile, the driving voltage of the device is reduced.
Owner:NINGBO LUMILAN NEW MATERIAL CO LTD

GaN-based light-emitting diode epitaxial wafer and preparation method thereof

The invention discloses a GaN-based light-emitting diode epitaxial wafer and a preparation method thereof, and belongs to the technical field of photoelectron manufacture. The epitaxial wafer comprises a substrate, a buffer layer, a non-doped GaN layer, an N-type contact layer, a stress release layer, an active layer, a P-type electron blocking layer and a P-type contact layer. The stress release layer, comprising a first sublayer, a second sublayer and a third sublayer, is arranged between the N-type contact layer and the active layer, wherein the second sublayer comprises InxGa1-xN layers and N-type doped second GaN layers laminated alternatively, so that the stress formed due to lattice mismatch of a bottom layer can be effectively released, the piezoelectric polarization effect is reduced, and anti-static performance and luminous efficiency of the epitaxial wafer are improved. The first sublayer, the second sublayer and the third sublayer are N-type doped layers, thereby facilitating current expanding, reducing resistance at the two sides of the stress release layer and increasing capacitance at the two sides of the stress release layer; and more electrons are accumulated, so that a better electron blocking effect is achieved, electric leakage channels are reduced, and furthermore, the antistatic capability is further improved.
Owner:HC SEMITEK ZHEJIANG CO LTD

Growing method for light-emitting diode epitaxial wafer

The invention discloses a growing method for a light-emitting diode epitaxial wafer, and belongs to the technical field of semiconductors. The growing method comprises the following steps: growing a low-temperature buffer layer, a high-temperature buffer layer, an N-type GaN layer, an N-type inserting layer, an active layer, an electron barrier layer and a P-type GaN layer in sequence on a substrate, wherein the growth temperature of the N-type GaN layer is greater than that of the N-type inserting layer which is greater than that of the active layer; the N-type inserting layer comprises a first sublayer, a second sublayer and a third sublayer which are laminated in sequence; the first sublayer is a superlattice structure formed by alternately laminating two GaN layers in which the doping concentrations of the N-type doping agents are different, and the doping concentration of the N-type doping agent in the first sublayer is smaller than that of the N-type doping agent in the N-type GaN layer; the second sublayer is an AlGaN layer or a superlattice structure formed by alternately laminating at least three AlGaN layers and at least three GaN layers; and the third sublayer is an InGaN layer. The N-type inserting layer in the invention plays a buffer role, and is beneficial for the growth of the active layer.
Owner:HC SEMITEK ZHEJIANG CO LTD

Red and yellow light emitting diode epitaxial wafer and preparation method thereof

The present invention discloses a red and yellow light emitting diode epitaxial wafer and a preparation method thereof, belonging to the field of the semiconductor technology. The epitaxial wafer comprises a N-type substrate, a N-type buffer layer, a N-type reflection layer, a N-type restriction layer, an electronic blocking layer, a multiple quantum well layer, a cavity regulation layer, a P-type restriction layer, a P-type current extension layer and a P-type ohmic contact layer. The electronic blocking layer includes an AlGaInP layer and an AlInP layer; the cavity regulation layer includes a first sublayer and at least two second sublayers; the first sublayer is a non-doped AlInP layer, and a second sublayer includes a P-type doped AlInP layer and a non-doped AlInP layer; and the dosage concentration of the P-type doped AlInP layer is smaller than the P-type doped AlInP layer of the P-type restriction layer. The electronic blocking layer is used for delaying electrons to reach the multiple quantum well layer, and the cavity regulation layer is configured to allow the cavities to be uniformly distributed in the regions closed to the multiple quantum well layer so as to increase the recombination rate of the electrons and the cavities and improve the luminous efficiency of the light emitting diode.
Owner:HC SEMITEK SUZHOU

A preparing method of a lotus seed amylase-aliphatic acid composite having a high composite index number

The invention relates to a preparing method of a lotus seed amylase-aliphatic acid composite having a high composite index number, and belongs to the technical field of modified starch processing. The method includes preparing lotus seed amylase into submicron order particles through superfine grinding, and forming the single-screw V-type amylase-aliphatic acid composite through microwave pretreatment and ultrahigh pressure treatment in assistant. The composite has the ultra-high composite index number and an embedding rate. The method includes steps of preparing the amylase, performing superfine grinding, pretreating aliphatic acids, performing microwave pretreatment, performing ultrahigh pressure compositing, cooling and crystallizing at a low temperature, washing with an alcohol, centrifuging, freeze-drying, smashing and packaging. A product of the method is high in composite index number, good in digestion resistibility and high in embedding rate. Compared with traditional preparing methods, a process of preparing the composite is free of chemical agent addition and high in safety, the composite can provide a sense of satiety and reduce blood glucose when the composite is added into foods, and the composite has a good application prospect.
Owner:FUJIAN AGRI & FORESTRY UNIV

Light-emitting diode epitaxial slice and manufacturing method thereof

The invention discloses a light-emitting diode epitaxial slice and a manufacturing method thereof and belongs to the technical field of semiconductors. The epitaxial slice comprises a substrate, a low-temperature buffer layer, a high-temperature buffer layer, an N-type layer, an active layer and a P-type layer, wherein the low-temperature buffer layer, the high-temperature buffer layer, the N-type layer, the active layer and the P-type layer are sequentially laminated on the substrate. The high-temperature buffer layer comprises at least two GaN layers, and the Si doping concentration of the at least two GaN layers is increased layer by layer from 0 in the growth direction of the epitaxial slice and is smaller than that of the N-type layer. By increasing the Si doping concentration of the at least two GaN layers layer by layer from 0 in the growth direction of the epitaxial slice, electrons can be effectively provided, a current expanding area is increased, the current expansibility is improved, electron injection efficiency is improved, the probability of recombination of the electrons and holes is improved, resistance in a high-power chip is reduced, chip voltage is greatly reduced, the capability chip of resisting a high current is improved, and chip reliability is improved.
Owner:HC SEMITEK SUZHOU

Deep ultraviolet LED epitaxial structure, preparation method thereof, and deep ultraviolet LED

The invention provides a deep ultraviolet LED epitaxial structure, a preparation method thereof, and a deep ultraviolet LED. The deep ultraviolet LED epitaxial structure comprises a substrate, a buffer layer, an N-type AlGaN layer, a multi-quantum well structure, an electron barrier layer, a P-type AlGaN layer and a P-type GaN layer, wherein the buffer layer, the N-type AlGaN layer, the multi-quantum well structure, the electron barrier layer, the P-type AlGaN layer and the P-type GaN layer are sequentially laminated upwards from the substrate. The P-type AlGaN layer comprises a first sub-layer, a second sub-layer and a third sub-layer, wherein the first sub-layer is P-type Al<x>Ga<1-x>N layer; the second sub-layer comprises non-doped Al<y>Ga<1-y>N layers and doped Al<y>Ga<1-y>N layers, which are stacked alternately, wherein the number of alternation times is greater than or equal to 1; the third sub-layer is P-type Al<z>Ga<1-z>N layer, wherein 1>x>y>z>0. According to the deep ultraviolet LED epitaxial structure provided by the invention, the luminous efficiency and the internal quantum efficiency of the ultraviolet LED are improved by changing the structure of the P-type AlGaN layer, so that the performance of the ultraviolet LED is improved.
Owner:MAANSHAN JASON SEMICON CO LTD

Aza-phenanthro-fluorene derivative and preparation method thereof as well as electrically-induced fluorescence luminescent device

The invention discloses an aza-phenanthro-fluorene derivative and a preparation method thereof as well as an electrically-induced fluorescence luminescent device. The structural general formula of the aza-phenanthro-fluorene derivative is as shown in the specification, wherein Ar1 and Ar2 in the structural general formula are carbazole groups. The aza-phenanthro-fluorene derivative disclosed by the invention has the advantages that the aza-phenanthro-fluorene derivative has a relatively good non-planar rigid structure, due to the introduction of heteroatom, the electron transfer rate of the fluorene compound is increased, the device efficiency is improved, meanwhile the fluorene compound is connected to other carbazole groups with high fluorescence quantum efficiency and hole transfer rate through 9-site of the aza-phenanthro-fluorene, the molecular rigidity of the whole compound can be enhanced very well, the glass transition temperature of the compound is increased, the luminescent layer hole and the electron transfer rate of the device are promoted, the exciton recombination probability is increased, the stability of the luminescent device is further improved, meanwhile the pi-pi stacking between molecules of the compound is inhibited, the red shift degree of electroluminescent spectra is reduced, and the efficiency of the fluorescence luminescent device is improved.
Owner:TCL CORPORATION

LED epitaxial structure with high light extraction efficiency and growing method thereof

The invention provides an LED epitaxial structure which comprises a substrate, a low-temperature buffer layer, a non-doped GaN layer, an Si-doped n-type GaN layer, an InxGa(1-x)N / GaN light emitting layer, an InX / Mg3N2 super-lattice inner roughed layer, a p-type AlGaN layer and a magnesium-doped p-type GaN layer, wherein the substrate, the low-temperature buffer layer, the non-doped GaN layer, the Si-doped n-type GaN layer, the InxGa(1-x)N / GaN light emitting layer, the InX / Mg3N2 super-lattice inner roughed layer, the p-type AlGaN layer and the magnesium-doped p-type GaN layer are successively laminated. The InX / Mg3N2 super-lattice inner roughed layer comprises 8-10 monomers which are arranged in an overlapped manner. Each monomer comprises an InN layer and a Mg3N2 layer. The LED epitaxial structure provided by the invention is advantageous in that the InX / Mg3N2 super-lattice inner roughed layer covers the light emitting layer; the InX / Mg3N2 material has an advantage of low mismatch with the GaN crystal lattice; high quality of the epitaxial layer crystal is realized; not only is light efficiency improved, but also antistatic capability can be improved; and LED product quality is improved. As an integral technical solution, the InX / Mg3N2 super-lattice inner roughed layer has advantages of increasing number of photons extracted from the LED in light unit time, reducing number of attenuation times of the photons in the LED, and correspondingly improving light extraction strength. The invention further discloses a growing method of the LED epitaxial structure. The growing method of the LED epitaxial structure has advantages of concise steps, easy process parameter control and convenient industrial production.
Owner:XIANGNENG HUALEI OPTOELECTRONICS

Organic electroluminescence device and preparation method thereof

The invention belongs to the field of electroluminescence devices and discloses an organic electroluminescence device and preparation method thereof. The organic electroluminescence device comprises an anode substrate, a hole injection layer, a hole transport layer, an electron barrier layer, a luminescent layer, a buffer layer and a cathode layer, wherein the anode substrate, the hole injection layer, the hole transport layer, the electron barrier layer, the luminescent layer, the buffer layer and the cathode layer are sequentially laminated. The material of the buffer layer is metal fluoride. By arranging the buffer layer between cathodes and the luminescent layer, permeation on the luminescent layer from the cathodes can be effectively avoided, and transmission performance of electrons is protected. Meanwhile, fluorine in the buffer layer can form bonding effect with material of the cathode layer so that Fermi level of the buffer layer and the cathode layer can be reduced to the same level, the band of the buffer layer can be bent, contact potential barriers of the luminescent layer and the cathode layer can be effectively reduced, energy needing to be overcome when the electrons are transmitted to the luminescent layer is reduced, transmission capacity of the electrons in the organic electroluminescence device is improved, and therefore luminous efficiency of the organic electroluminescence device is achieved.
Owner:OCEANS KING LIGHTING SCI&TECH CO LTD +1

Inverted type full inorganic nanometer oxide quantum dot light-emitting diode and manufacturing method thereof

The invention discloses an inverted type full inorganic nanometer oxide quantum dot light-emitting diode and a manufacturing method of the inverted type full inorganic nanometer oxide quantum dot light-emitting diode. The inverted type full inorganic nanometer oxide quantum dot light-emitting diode comprises a cathode, an electronic transmission layer, a hole transmission layer, a quantum dot light-emitting layer and an anode. One end of the quantum dot light-emitting layer is connected with the hole transmission layer connected with the anode, and the other end of the quantum dot light-emitting layer is connected with the electronic transmission layer connected with the cathode. Titanium dioxide is adopted as the electronic transmission layer, and nickel oxide is adopted as the hole transmission layer. The manufacturing method comprises the following steps that the cathode is manufactured on a glass sheet, and the cathode is coated with titanium dioxide precursor solutions in a spin mode to manufacture the inorganic electronic transmission layer; quantum dots are manufactured in a high temperature metal decomposition method, and the quantum dot light-emitting layer is manufactured on the electronic transmission layer; the nickel oxide is manufactured on the light-emitting layer as the hole transmission layer; the anode is manufactured on the hole transmission layer. According to the light-emitting diode, a light-emitting face is the front face, the inverted type structure and inorganic materials can reduce sensitivity of the light-emitting diode to oxygen and water, and the light-emitting service life of the light-emitting diode is prolonged under the same condition.
Owner:SOUTHEAST UNIV

Manufacturing method of epitaxial wafer of GaN-based light emitting diode

The invention discloses a manufacturing method of an epitaxial wafer of a GaN-based light emitting diode, and belongs to the technical field of semiconductors. The manufacturing method includes the steps that a substrate is provided; a buffer layer, an undoped GaN layer, an n-type layer, a multi-quantum well layer and a p-type layer are grown on the substrate in sequence, wherein the multiple quantum well layer is of a superlattice structure, each period includes a quantum well layer and a quantum barrier layer, and the growth temperature of at least two quantum barrier layers tightly adjacent to the p-type layer is higher than that of the quantum barrier layers except for the two quantum barrier layers. The growth temperature of the quantum barrier layers close to the n-type layer is low, crystal quality is poor, stress is relieved step by step, then the piezoelectric polarization effect is weakened, and growth of the quantum barrier layers close to the p-type layer is facilitated. As the growth temperature of the quantum barrier layers close to the p-type layer is high, the crystal quality is well improved, the full width at half maximum is decreased, the electron-hole composite probability is further improved, and then the light emitting efficiency of the GaN-based light emitting diode is improved.
Owner:HC SEMITEK SUZHOU
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