The invention discloses an
image sensor and a forming method thereof. By forming the
oxide layer on the
silicon substrate and carrying out surface
nitriding treatment on the
oxide layer, the interface stability of the
oxide layer can be improved, and the recombination of carriers at the interface can be inhibited. Meanwhile,
boron-doped
polycrystalline silicon is deposited in the deep groove, and
boron is diffused towards the side wall of the groove through heat treatment to form a surface pinning layer, so that the pixel charge storage capacity is enhanced. The
nitriding treatment can effectively control the
boron diffusion depth and concentration, avoids reverse
doping of the shallow layer of the
photodiode, improves the
dielectric constant of the side wall oxide layer, and increases the local
capacitance and the controlled
charge density. And
negative potential is applied to the
deep trench polycrystalline silicon, so that a stronger energy band downward bending effect can be formed, accumulation and recombination of interface carriers are further inhibited, and
dark current and
white point defects are reduced. According to the invention, through collaborative optimization of the
nitriding oxide layer,
polycrystalline silicon doping and potential regulation, comprehensive regulation of a
deep trench interface
electric field, carrier distribution and
doping diffusion behaviors is realized, and the full well capacity, the imaging uniformity and the overall performance of the small-
pixel image sensor are effectively improved on the premise of not increasing complex process steps.