Housing design method, housing, and electronic equipment including the housing
A design method and housing technology, applied in the fields of electrical equipment shells/cabinets/drawers, chemical instruments and methods, electrical components, etc., can solve the problems of short service life of electronic equipment, unfavorable heat dissipation of electronic equipment, poor user experience, etc. Achieve the effect of improving heat dissipation effect, good heat dissipation effect and improving heat dissipation capacity
Active Publication Date: 2016-03-30
HUAWEI DEVICE CO LTD
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Problems solved by technology
[0007] The housing of the electronic equipment in the prior art has a poor heat dissipation effect, which is not conducive to the heat dissipation of the electronic equipment, resulting in a short service life of the electronic equipment, poor product reliability, and poor user experience
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[0016] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0017] Such as figure 1 As shown, the embodiment of the present invention provides a design method of the shell, and the shell is set to be composed of a structural layer 110 located on the outside and a heat conducting layer 120 located on the inside and conducive to heat dissipation. Cascading settings. The heat conduction layer 120 of the inner layer is made of modified heat conduction plastic with good thermal conductivity, and the structural layer 110 of the outer layer is made of ordinary plastic with good structural strength and can meet the requirements of spraying, which perfectly complem...
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Abstract
The invention is applied to the field of electronic equipment, and discloses a shell body design method, a shell body, and the electronic equipment including the shell body. According to the shell body design method, the shell body is arranged to be composed of a structure layer located on the outer side and a heat conduction layer located on the inner side and facilitating heat dissipation, and the structure layer and the heat conduction layer are arranged in a laminating mode. The shell body is formed by the heat conduction layer and the structure layer which are arranged in the laminating mode, the heat conduction layer is located on the inner side, and the structure layer is located on the outer side. The electronic equipment comprises the shell body. According to the shell body design method, the shell body, and the electronic equipment including the shell body, a heat dissipation effect of the shell body is improved so as to facilitate improvement of heat dissipation capacity of the electronic equipment, thus reliability of products is improved, and service life of the products is prolonged beneficially.
Description
technical field [0001] The invention belongs to the field of electronic equipment, and in particular relates to a design method of a casing, the casing, and electronic equipment including the casing. Background technique [0002] With the development of technology, mobile terminals are becoming more and more popular, and are developing in the direction of more intelligence, higher integration, stronger functions, and higher energy consumption. Today's portable electronic devices, such as smart phones, integrate multiple functions such as audio and video calls, text messages, multimedia, Internet access, video games, photography, recording, calculation, and file management. While bringing more convenience to users, the power consumption of mobile terminals also increases exponentially. [0003] For portable consumer electronic products (such as MP3, MP4, mobile phones, data cards, etc.) with strict product volume restrictions, it is impossible to provide installation space f...
Claims
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IPC IPC(8): H05K5/00H05K7/20B32B27/06B32B27/18B32B7/12
Inventor 周列春黄焱翥阳军
Owner HUAWEI DEVICE CO LTD