Cold and hot bidirectional chip of semiconductor

Abstract

The invention relates to a cold and hot bidirectional chip of a semiconductor. The cold and hot bidirectional chip comprises a plurality of NP (Negative / Positive) type semiconductor units, wherein each NP type semiconductor unit comprises N-type semiconductors and P-type semiconductors; first current deflectors are connected with one sides of the N-type semiconductors and the P-type semiconductors; second current deflectors are connected with the other sides of the N-type semiconductors and the P-type semiconductors of any two adjacent NP type semiconductor units; cold-end heat conduction columns are respectively connected with each of the first current deflectors; the cold-end heat conduction columns directly extend in an external space; hot-end heat conduction columns are respectively connected with each of the second current deflectors; the hot-end heat conduction columns directly extend in the external space; heat conduction insulating layers are respectively arranged on two sides of the cold and hot bidirectional chip of the semiconductor; the heat conduction insulating layers are respectively arranged on the first current deflectors and the second current deflectors in a covering manner; and the cold-end heat conduction columns and the hot-end heat conduction columns stretch out of the heat conduction insulating layer respectively.

Description

Technical field [0001] The invention relates to a cold and hot temperature generating device, in particular to a semiconductor cold and hot chip that uses N-type semiconductors and P-type semiconductors to respectively produce cooling and heating effects on both sides of the chip. Background technique [0002] As we all know, in 1834, the French Peltier (PELTIEREFFECT) discovered that when current flows through the junction formed by two different conductors, the phenomenon of heat release and absorption occurs at the junction. According to the above-mentioned principle, the semiconductor refrigerator as a refrigerator device has been more commonly used by people. The semiconductor refrigerator is a cooling device composed of semiconductors, and its core refrigeration part is composed of many N-type and The P-type semiconductor particles are arranged with each other. The N-type semiconductor and the P-type semiconductor are connected by a general conductor to form a complete circ...

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Problems solved by technology

[0007] Studying the reasons for its low electrical conversion efficiency, we will find that it is mainly due to the fact that there are too many layered structures on the upper and lower sides of the N-type semiconductor and the P-type semiconductor. As mentioned above, the thermally conductive adhesive layer 3 is generally made of It is made of high-efficiency heat-conducting adhesive, and the thermal conductivity of high-efficiency heat-conducting adhesive is generally below 5W / m.k. The ceramic heat-conducting insulating layer 4 is generally made of high-efficiency heat-conducting ceramics, and the maximum thermal conductivity of high-efficiency heat-conducting ceramics is about 25W / m.k. The solder layer The thermal conductivity of 1 is about 67W / m.k, so the cold (or heat) generated by the PN type semiconductor passes through the solder layer 1, the flow guide layer 2, the thermally conductive adhesive layer 3 and the ceramic thermally insulating layer 4. Several low-efficiency thermally conductive materials After being exported, it has been greatly reduced, which will inevitably lead to the low overall electrical conversion efficiency of semiconductor refrigerators, but there is no technology that can improve the overall electrical conversion efficiency of semiconductor refrigerators, and this is the main shortcoming of traditional technologies

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