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Hybrid printed circuit board and method of making the same

A technology for printed circuit boards and manufacturing methods, which is applied to the manufacture of printed circuits, printed circuits, electrical components, etc., can solve problems such as poor alignment, and achieve the effects of improving production quality and overcoming poor alignment

Active Publication Date: 2016-07-06
NEW FOUNDER HLDG DEV LLC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0029] The present invention aims to provide a mixed pressure PCB and its manufacturing method to solve the problem of poor alignment in the prior art

Method used

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  • Hybrid printed circuit board and method of making the same
  • Hybrid printed circuit board and method of making the same
  • Hybrid printed circuit board and method of making the same

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Embodiment Construction

[0041] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings and the embodiments.

[0042] Figure 5 Shows a flowchart of a method for manufacturing a mixed-compression PCB according to an embodiment of the present invention, including:

[0043] Step S10, setting positioning holes at corresponding positions of the high-frequency material daughter board, the mother board, and the PP sheet used to bond the high-frequency material daughter board and the mother board;

[0044] Step S20, using the positioning holes to perform mutual positioning of the high-frequency material daughter board, the mother board, and the PP sheet;

[0045] In step S30, the high-frequency material daughter board is bonded to the mother board through the PP sheet by pressing.

[0046] In this method, because the positioning holes are provided, the alignment accuracy of the high-frequency material daughter board and the motherboard can be improved, the problem of ...

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PUM

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Abstract

The invention provides a manufacture method of a mixed-compressing printed circuit board (PCB). The manufacture method includes: respectively arranging positioning holes on corresponding positions of a high-frequency material auxiliary board, a main board and a polypropylene (PP) sheet; positioning the high-frequency material auxiliary board, the main board and the PP sheet through the positioning holes; and bonding the high-frequency material auxiliary board between the PP sheet and the main board through lamination. The mixed-compressing PCB is manufactured by the manufacture method, and the manufacture quality of the mixed-compressing PCB is improved.

Description

Technical field [0001] The present invention relates to the field of printed circuit boards (PCBs), and in particular to a mixed-compression PCB and a manufacturing method thereof. Background technique [0002] figure 1 Shows a three-dimensional schematic diagram of a hybrid PCB; figure 2 show figure 1 The cross-sectional schematic diagram of the mixed-press PCB; image 3 show figure 1 The top view of the mixed-voltage PCB; Figure 4 show figure 1 The top view of the high-frequency material daughter board in the mixed-voltage PCB. If the PCB is only partially (mostly smaller than 1 / 3 of the entire board) and high-frequency signals are needed, use local (mostly less than 1 / 3 of the entire board) to press the high-frequency material sub-board to make a mixed-voltage PCB, which can reduce expensive The use of high-frequency plates greatly reduces PCB costs. [0003] figure 1 figure 2 The manufacturing process of mixed-press PCB in China includes: [0004] 1. Daughter board process ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K1/00
Inventor 陈杰标
Owner NEW FOUNDER HLDG DEV LLC