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Test equipment

A technology of testing equipment and testing platform, which is applied in the direction of electronic circuit testing, etc., can solve problems such as damage to functional block chip groups, single chip damage, and reduced test accuracy, so as to avoid excessive temperature and maintain accuracy.

Inactive Publication Date: 2013-07-03
江西联速科技有限公司 +1
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  • Summary
  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When performing the above electrical tests, if the power-on time is too long, the temperature of the packaged chip will be too high. If the temperature exceeds the limit and the test is continued, not only will a single chip be damaged, but in severe cases, the entire functional block may be damaged. All groups are damaged
If a heat sink is placed on the package chip to reduce the temperature of the package during testing, the test accuracy may be reduced due to the interference caused by the heat sink

Method used

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Embodiment Construction

[0035] figure 1 It is a cross-sectional view of a testing device according to an embodiment of the present invention. figure 2 for figure 1 A partial enlarged view of the test equipment. Please refer to figure 1 and figure 2 , the testing device 100 of this embodiment includes a testing platform 110 and at least one temperature sensing device 120 . The test platform 110 is used for carrying a circuit board 50 and testing at least one package chip 52 on the circuit board 50 . The temperature sensing device 120 is disposed above the packaging chip 52 and used for sensing the infrared rays I emitted by the packaging chip 52 to estimate the temperature of the packaging chip 52 . There is a distance D between the packaging chip 52 and the temperature sensing device 120 .

[0036] With this configuration, in the process of testing the packaged chip 52, the user can know whether the temperature of the packaged chip 52 is too high through the temperature sensing device 120, so...

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Abstract

The invention relates to test equipment which comprises a test platform and at least one temperature sensing device. The test platform is used for bearing a circuit board and testing at least one encapsulation chip on the circuit board. The temperature sensing device is configured above the encapsulation chip and used for sensing infrared rays emitted by the encapsulation chip to estimate a temperature value of the encapsulation chip. A space is formed between the encapsulation chip and the temperature sensing device.

Description

technical field [0001] The invention relates to a testing device, in particular to a testing device for testing packaged chips. Background technique [0002] With the development of electronics and information technology, various electronic products are gradually popularized in the market, such as notebook computers, tablet computers, smart phones, digital cameras and other products have become indispensable equipment for many consumers. No matter what kind of electronic product it is, the packaged chip inside it needs to pass various electrical tests to make the product have good quality and reliability. [0003] For example, when performing In-Circuit Testing (ICT) on a packaged chip, the circuit board and the packaged chip on it are fixed in a low-voltage closed space of the test equipment, and then the packaged chip is opened / shorted (open / short) or power on (power on) and other tests. When performing the above electrical tests, if the power-on time is too long, the te...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
Inventor 李兴银金志仁黄培伦
Owner 江西联速科技有限公司
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