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Radiating device

A technology of heat dissipation device and heat dissipation module, which is applied in indirect heat exchangers, lighting and heating equipment, instruments, etc., can solve problems such as unfavorable assembly efficiency, unfavorable standardized operation, and improvement.

Inactive Publication Date: 2013-07-03
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Heat pipes are widely used in radiators due to their ultra-high heat conduction efficiency. In order to improve the heat generated by the CPU from the base of the radiator to the heat dissipation fins, multiple heat pipes are used to increase the contact with the heat dissipation fins. Area is a common method, but when mass assembling this kind of radiator in the factory, since multiple heat pipes need to be installed through the fin group of the radiator from different directions or angles, it is necessary to set up such as turning the fin group to different directions. Or angle to adapt to the additional process of installing multiple heat pipes, which is not conducive to the standardized operation of the factory, and is not conducive to the improvement of assembly efficiency

Method used

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Embodiment Construction

[0021] see figure 1 , In a preferred embodiment, a heat dissipation device 1 includes a base 10 and two heat dissipation modules 20 , each heat dissipation module 20 includes a fin set 22 and a heat pipe 24 .

[0022] The lower surface of the base 10 can abut against a heating electronic component, and two grooves 12 and 14 are arranged on the upper surface. The grooves 12 and 14 are arranged in parallel at the center of the upper surface of the base 10 and span the entire upper surface of the base 10, and the direction of the grooves 12 and 14 is the same as the wider direction of the base 10, so that The length of the grooves 12 and 14 can be made the longest to increase the contact area between the heat pipe 24 and the upper surface of the base 10 and improve the heat conduction effect.

[0023] The fin group 22 is composed of a plurality of heat dissipation fins arranged in parallel, and a wind guide surface is provided between every two adjacent heat dissipation fins. T...

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Abstract

The invention relates to a radiating device, which comprises a base and two radiating modules, wherein the lower surface of the base can be connected with a heating element in a resisting way. Each radiating module comprises a fin group and a heat conducting pipe. A through hole is formed in the fin group. Each heat conducting pipe comprises a heat conducting part which is in contact with the lower surface of the fin group, an extension part which penetrates through the through hole, and a connecting part which is connected with the heat conducting part and the extension part. The two radiating modules are abreast arranged on the upper surface of the base in opposite directions. The lower surface of the fin group and the heat conducting part of the heat conducting pipe of each radiating module are in contact with the upper surface of the base.

Description

technical field [0001] The invention relates to a heat dissipation device. Background technique [0002] Now the running speed of the computer is getting faster and faster, because the running speed of the computer mainly depends on the central processing unit, so the running speed of the central processing unit is also getting faster and faster, but for integrated circuit electronic components such as the central processing unit , the faster the running speed, the more heat it generates per unit time, if it is not discharged in time, it will cause its temperature to rise and cause its operation to be unstable. It is a common practice in the industry to install a radiator on the upper surface of the central processing unit to assist its heat dissipation. With the continuous improvement of the performance of the central processing unit, the radiator used by it is also continuously improved. [0003] Heat pipes are widely used in radiators due to their ultra-high heat conduct...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20H01L23/427
CPCF28D15/0275G06F1/20H01L23/427H01L2924/0002H01L2924/00
Inventor 付双
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD