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Method for producing solder balls

A manufacturing method and technology of solder balls, applied in the direction of manufacturing tools, welding/cutting media/materials, welding equipment, etc., can solve the problems of current difficulties, difficulty in thickening the solder layer, and inability to form solder bumps, etc., and achieve good efficiency , Reduce manufacturing cost, simplify the effect of forming process

Inactive Publication Date: 2015-07-08
RESONAC HOLDINGS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the method of manufacturing solder bumps using the electroless plating method, it is difficult to increase the thickness of the solder layer (solder layer), so it is not possible to firmly bond electronic components and conductive circuit electrodes.
In addition, in the solder bump manufacturing method using the electroplating method, it is difficult to flow a current for plating layer formation through a complicated circuit, so it is impossible to form solder bumps with fine pattern shapes.
In addition, in the method of printing solder paste, it is difficult to correspond to fine-pitch patterns, so it is impossible to form solder bumps with fine pattern shapes.

Method used

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  • Method for producing solder balls
  • Method for producing solder balls
  • Method for producing solder balls

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Experimental program
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no. 1 approach ）

[0100] Hereinafter, a method of manufacturing the solder ball 70 according to the first embodiment of the present invention will be described with reference to the drawings. Figure 1A to Figure 1E It is a process drawing explaining the manufacturing method of the solder ball of this embodiment.

[0101] The manufacturing method of the solder ball 70 of the first embodiment is roughly constituted by the following steps: a first step of attaching the nuclei 11 to the surface 1a of the base material 1 provided with the first adhesive layer 5; 11a forms the second process of the second adhesive layer 13; the third process of adhering solder particles 14 on the surface of the second adhesive layer 13; the fourth process of melting the solder particles 14 to form a solder layer 15 on the nuclei 11; and from The fifth step in which the core body 11 is peeled off from the base material 1 .

[0102] On the adhesive layer 13, before the nucleus 11 is attached, a member 21 (first membe...

no. 2 approach ）

[0195] Next, a method of manufacturing solder ball 70 as a second embodiment of the present invention will be described with reference to the drawings. Figure 2A to Figure 2E It is a process drawing explaining the manufacturing method of the solder ball 70 of 2nd Embodiment.

[0196] The manufacturing method of the solder ball 70 in the second embodiment is roughly constituted by the following steps: a first step of attaching the nuclei 11 to the surface 5a of the first adhesive layer 5 provided on the surface 1a of the base material 1; The surface 11a of 11 forms the second process of second adhesive layer 13; The third process of adhering solder particles 14 on the surface of second adhesive layer 13; Solder particles 14 are melted to form the fourth process of solder layer 15; 11 The fifth step of peeling the base material 1.

[0197] Wherein, in the first process, the first member 21 is composed of the first layer 21a (the first layer of the first member) and the second ...

no. 3 approach ）

[0224] Next, a method of manufacturing solder ball 70 according to a third embodiment of the present invention will be described with reference to the drawings. Figure 3A to Figure 3F It is a process diagram explaining the manufacturing method of the solder ball 70 of 3rd Embodiment.

[0225] The manufacturing method of the solder ball 70 in the third embodiment is roughly constituted by the following steps: the first step of attaching the nuclei 11 to the surface 5a of the first adhesive layer 5 provided to the base material 1; The second process of forming the second adhesive layer 13; the third process of attaching the solder particles 14 to the surface of the second adhesive layer 13; the fourth process of melting the solder particles 14 to form the solder layer 15; and peeling the base material from the core body 11 1 of the fifth process.

[0226]In the third embodiment, between the first step and the second step, there is a step of peeling off the first member 21, and...

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Abstract

The present invention relates to a method for producing solder balls (70), the method comprising: a first process in which core bodies (11) are attached to a surface (1a) of a base material (1) having a first adhesion layer (5); a second process in which second adhesion layers (13) are formed on surfaces (11a) of the core bodies (11); a third process in which solder particles (14) are attached to surfaces of the second adhesion layers (13); a fourth process in which the solder particles (14) are fused to form solder layers (15); and a fifth process in which the base material (1) is separated from the core bodies (11) so as to obtain solder balls.

Description

technical field [0001] The present invention relates to a method of manufacturing solder balls. [0002] This application claims priority based on Patent Application No. 2010-241029 for which it applied to Japan on October 27, 2010, The content is used for this application. Background technique [0003] In recent years, as a means of forming electronic circuits, the following method has been widely used: a circuit pattern is provided on a plastic substrate, a ceramic substrate, or an insulating substrate coated with plastic, and an IC element is soldered (soldered) on the circuit pattern. , semiconductor chips, resistors or capacitors and other electronic components. [0004] Among them, as a method of bonding a predetermined part of a circuit board to a lead terminal of an electronic component, the following steps are generally performed in sequence: a step of forming a thin layer of solder on the surface of a conductive circuit electrode on the circuit board in advance; ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/40
CPCB23K35/0244H01L2224/11334B23K35/262B23K35/40B22F1/00B22F1/16
Inventor 庄司孝志堺丈和
Owner RESONAC HOLDINGS CORPORATION