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Solder bath

A technology of solder tank and molten solder, applied in welding equipment, tin feeding device, metal processing equipment, etc., can solve the problem of high cost

Active Publication Date: 2016-12-28
TAMURA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, insulators, ceramics, etc. are difficult materials to handle, and there is also a problem of high cost

Method used

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Embodiment Construction

[0019] The embodiments described below are preferred specific examples of the present invention, and include various technically preferable limitations. However, in the following description, the scope of the present invention is not limited to these embodiments unless the gist of the present invention is limited in particular.

[0020] The structure of the solder bath

[0021] One embodiment of the present invention will be described. figure 1 It is a schematic cross-sectional view of a soldering apparatus 1 having a solder tank according to one embodiment of the present invention. The soldering device 1 has a solder tank 2, a substrate conveying unit (not shown), an input heater (in figure 1 omitted), the pump 3 and the detection unit 4.

[0022] The solder tank 2 has a double configuration of an inner tank 11 and an outer tank 16 . The inner tank 11 accommodates molten solder 5 . The molten solder 5 is accommodated in the vicinity of the upper part of the inner tank ...

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PUM

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Abstract

The invention provides a solder groove. Solder leakage can be detected in the solder groove of a double structure formed by an inner groove and an outer groove, and support of the solder groove can be made firm. The solder groove comprises the inner groove of an electroconductive constructional element which is used for accepting melted solder, the outer groove of the electroconductive constructional element which holds the inner groove with a specific gap between the outer groove and the inner groove, and a detection electrode which protrudes from the outer groove towards the gap and is in electric insulation from the outer groove. Conduction between at least one of the inner groove and the outer groove and the detection electrode is detected. In addition, the inner groove and the outer groove are fixed by means of a constructional member made of metal.

Description

technical field [0001] The invention relates to a solder bath. Background technique [0002] For the soldering of printed wiring boards, wave soldering in which the printed wiring board is immersed in a solder bath containing molten solder is widely used. However, during continued use, corrosion caused by solder can develop in the solder bath. In recent years, in the case of lead-free solders that have been popularized, there is a problem that the solder bath of stainless steel tends to corrode for various reasons compared with conventional tin-lead eutectic solders. Therefore, countermeasures are taken to delay the occurrence of corrosion and slow down the progress of corrosion. However, a fundamental countermeasure has not yet been found. [0003] In order to prevent the solder tank from being corroded and the solder flowing out to the outside, a solder tank having a double structure including an inner tank and an outer tank is used. In order to detect the leakage of s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K3/06
Inventor 饭田诚
Owner TAMURA KK