A kind of solder reducing agent automatic adding device
An automatic adding and reducing agent technology, applied in auxiliary devices, welding equipment, metal processing equipment, etc., can solve the problems of high cost and inaccurate addition of solder reducing agent, achieve timely addition, realize control automation, and reduce agent addition accurate effect
Inactive Publication Date: 2015-11-25
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[0003] The invention proposes a solder reducing agent automatic adding device to solve the problems of inaccurate solder reducing agent addition and high cost in the prior art
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[0036] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.
[0037] figure 1 Shown is a schematic structural diagram of an embodiment of the automatic solder reducing agent adding device of the present invention. It can be seen from the figure that the automatic solder reducing agent adding device is used to control the addition of solder reducing agent to the solder pool 15, including: a liquid storage container 2 , used to store the solder reducing agent; the liquid pump 3 is used to transport the solder reducing agent in the liquid storage container 2 to the filling cup 4; the filling cup 4 is used to store the solder reducing agent delivered by the liquid pump 3 and its outlet A control valve 6 is provided; the first...
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The invention relates to an automatic adding device of welding flux reducing agents. The automatic adding device comprises a liquid storing container, a liquid pump, a liquid adding cup, a first detecting device and a controller, wherein the liquid storing container is used for storing the welding flux reducing agents, the liquid pump is used for conveying the reducing agents in the liquid storing container to the liquid adding cup, the liquid adding cup is used for storing the reducing agents conveyed by the liquid pump, in addition, the outlet part of the liquid adding cup is provided with a control valve, the first detecting device is arranged in the first preset position in the liquid adding cup, is used for detecting the dosage of the reducing agents in the liquid adding cup and outputs first detecting signals, and the controller is used for controlling the liquid pump to stop working according to the first detecting signals and is used for opening the control valve for controlling the reducing agents in the liquid adding cup to completely enter a welding flux pool after the liquid pump stops working. The adding device has the advantages that the quantitative and automatic addition of the reducing agents can be realized, and the addition is more accurate and convenient.
Description
technical field [0001] The invention relates to a material adding device, in particular to an automatic solder reducing agent adding device. Background technique [0002] In wave soldering equipment, the solder in the solder pool will automatically generate welding slag during the welding process. The welding slag will affect the welding work and cause low welding efficiency. Therefore, it is necessary to continuously remove the welding slag during the welding process. It is to add a solder reducing agent to the solder pool to degrade the welding slag, but adding the reducing agent requires accurate control of the amount of the additive, which is troublesome, inaccurate, and costly to add the reducing agent manually; therefore, how to accurately add the reducing agent as required and timely Adding reducing agent has become a difficult problem in the industry. Contents of the invention [0003] The invention proposes an automatic solder reducing agent adding device to solv...
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IPC IPC(8): B23K3/08H05K3/34
Inventor 张奇勇胡海涛