Neighbor trimming of virtual-filled shapes with built-in optical proximity correction for semiconductor applications

Abstract

Near-neighbor trimming of dummy fill shapes with built-in optical proximity corrections (OPCs) for semiconductor applications is provided. A method for the near-neighbor trimming includes adding one or more hole shapes onto a semiconductor design layout comprising a plurality of design shapes. The method further includes trimming adjacent ones of the plurality of which are covered by the one or more hole shapes.

Description

technical field [0001] The present invention relates to semiconductor structures and methods of fabrication thereof and, more particularly, to proximity trimming of dummy-filled shapes with built-in optical proximity correction (OPC) for semiconductor applications. Background technique [0002] In semiconductor applications, dummy fill shapes may be included in semiconductor designs to improve shape uniformity within the design. In semiconductor design, most design features can include dummy fill shapes. Uniform local shape and density facilitate fabrication processes such as chemical mechanical polishing (CMP). To enable robust lithography rendering, small virtual shapes require optical proximity correction (OPC ) and optical rule checking (ORC) processing. [0003] For advanced semiconductor technologies, if the periodicity (i.e., the width of features plus the spacing between features) requires that the semiconductor design have a dummy fill shape that is smaller than ...

AI Technical Summary

Problems solved by technology

However, OPC is time consuming and expensive to implement

While OPC is an unavoidable cost to the design features that make up functional circuits in semiconductor designs, it is an undesired burden on dummy fill shapes

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