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Semiconductor packaging structure

A packaging structure and semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problems of difficult operation control, excessive side erosion, etc., and achieve reduced side erosion and reliable bump packaging. effect of structure

Active Publication Date: 2013-08-14
NANTONG FUJITSU MICROELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The existing method is difficult to control the operation, and there is still the problem of excessive side erosion when the cooperation is not good

Method used

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  • Semiconductor packaging structure
  • Semiconductor packaging structure

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Embodiment Construction

[0014] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Elements and features described in one drawing or one embodiment of the present invention may be combined with elements and features shown in one or more other drawings or embodiments. It should be noted that representation and description of components and processes that are not related to the present invention and known to those of ordinary skill in the art are omitted from the drawings and descriptions for the purpose of clarity. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the ar...

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Abstract

The invention discloses a semiconductor packaging structure which comprises a bump, wherein bulge pieces are arranged at the periphery of the bottom of the bump; the material of the bulge pieces are the same with that of the bump; and the bulge pieces are formed once with the bump in an electro-plating process. According to the semiconductor packaging structure, the bulge pieces are arranged at the bottom of the bump and perform a compensation function during wet etching, so that lateral erosion is reduced, and the more reliable bump packaging structure is formed.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a semiconductor packaging structure. Background technique [0002] In the usual bump processing technology, when the sputtering layer is etched by wet method, the side etching caused by isotropy is always a problem. When the side etching is too large, the chemical solution will attack the aluminum layer at the bottom, resulting in electrical sexual loss. Existing methods reduce the amount of lateral etching through the cooperation of etching equipment and potions. In the existing method, the operation is difficult to control, and there is still the problem of excessive side erosion when the cooperation is not good. Contents of the invention [0003] A brief overview of the invention is given below in order to provide a basic understanding of some aspects of the invention. It should be understood that this summary is not an exhaustive overview of the invention. It is n...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/485
CPCH01L2224/11
Inventor 缪小勇
Owner NANTONG FUJITSU MICROELECTRONICS