Complete set of automation equipment for led module packaging

A technology for LED modules and complete sets of equipment, applied in the directions of transportation and packaging, conveyor objects, electrical components, etc., can solve the problems of lack of integration, low automation rate of LED module packaging, etc., to improve packaging efficiency and save labor costs. Effect

Active Publication Date: 2016-01-06
SOUTH CHINA UNIV OF TECH
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

The packaging of traditional LED modules, the loading of the LED one-piece lens and the substrate, and the unloading of the LED one-piece lens bracket after edge trimming are all done manually; while the cover lens, edge trimming, and glue injection processes use independent equipment. There is no effective integration between them, and the automation rate of LED module packaging is not high

Method used

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  • Complete set of automation equipment for led module packaging
  • Complete set of automation equipment for led module packaging
  • Complete set of automation equipment for led module packaging

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Embodiment Construction

[0032] The present invention will be described in further detail below with reference to the accompanying drawings and embodiments.

[0033] It should be noted that the accompanying drawings are only used for exemplary description and should not be construed as a limitation on the present patent; for those skilled in the art, it is understandable that some well-known structures and their descriptions in the accompanying drawings may be omitted.

[0034] The embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0035] like figure 2 , image 3 As shown, an LED module packaging automation complete set of equipment includes a conveying mechanism 26, a feeding mechanism 21, a cover lens mechanism 22, a blanking mechanism 23, a blanking mechanism 24 and a glue injection mechanism 25 arranged in sequence along the conveying mechanism 26 ,

[0036] like Figure 4 As shown, the conveying mechanism 26 includes ...

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Abstract

Provided is an LED module encapsulation automatic complete apparatus comprising six parts that are a feed mechanism (21), a lens covering mechanism (22), a discharge mechanism (23), a side pressing mechanism (24), a glue pouring mechanism (25) and a transmission mechanism (26 ) for an LED module encapsulation. Conversion and integration of an LED substrate among encapsulation processes including a feeding process, a lens covering process, a discharging process, a side pressing process and a glue pouring process are achieved. According to the LED module encapsulation automation complete apparatus, the feed mechanism, the discharge mechanism and the transmission mechanism are added on the basis of a traditional LED module with a side pressing apparatus, a lens covering apparatus and a glue pouring apparatus, meanwhile, interfaces between the existing apparatus and each of the automation feed mechanism, the discharging mechanism and the transmission mechanism are designed, so that integration of all the apparatuses and encapsulation automation of the LED module are achieved. Not only encapsulation efficiency of the LED module is improved, but also labor cost is reduced at the same time.

Description

technical field [0001] The invention mainly relates to the field of semiconductor application and packaging, and in particular to the technical field of LED module packaging. Background technique [0002] High-power LEDs are small in size, long in life, and high in electro-optical conversion efficiency. They are the fourth-generation "green lighting source". In the light source manufacturing industry such as street lamps and floodlights, it has a wide range of application prospects and has received more and more attention. The packaging of LED modules is the key process at the end of LED lighting manufacturing. [0003] As shown in Fig. 1 is the LED conjoined lens module, 11 is the LED conjoined lens bracket before trimming, 12 is the substrate of the LED module, including aluminum substrate, ceramic plate, etc., 13 is the LED chip, 14 is the LED lens Installation groove, 15 is the LED conjoined lens bracket after trimming, 16 is the single LED lens, 17 is the LED glue inj...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L21/677
CPCH01L33/005H01L33/52H01L2933/005
Inventor 胡跃明刘伟东陈安吴忻生
Owner SOUTH CHINA UNIV OF TECH
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