Magnetic levitation heat insulation device

A technology of heat insulation device and magnetic levitation, applied in the field of measurement, can solve the problem of difficult to ensure that the heaters are identical, and achieve the effect of improving the measurement speed and accuracy, reducing the complexity of calibration, and improving the applicability

Active Publication Date: 2013-09-04
INST OF ELECTRONICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] However, no matter what kind of insulation material is used, it is difficult to ensure that the heat generated by the heater is exactly the same as the heat flowing through the measured sample due to the actual physical contact between the heater and the outside world.
Therefore, the measurement device has inherent errors and requires precise calibration and regular maintenance to obtain accurate measurements

Method used

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  • Magnetic levitation heat insulation device
  • Magnetic levitation heat insulation device
  • Magnetic levitation heat insulation device

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Embodiment Construction

[0034] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings. It should be noted that, in the drawings or descriptions of the specification, similar or identical parts all use the same figure numbers. Implementations not shown or described in the accompanying drawings are forms known to those of ordinary skill in the art. Additionally, while illustrations of parameters including particular values ​​may be provided herein, it should be understood that the parameters need not be exactly equal to the corresponding values, but rather may approximate the corresponding values ​​within acceptable error margins or design constraints. In addition, the directional terms mentioned in the following embodiments, such as "upper", "lower", "front", "rear", "left", "right", etc., are only referring t...

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Abstract

The invention provides a magnetic levitation heat insulation device, which comprises a base, a platform and a magnetic levitation mechanism, wherein the magnetic levitation mechanism is arranged between the base and the platform, and comprises a first magnet body support array which comprises a plurality of first magnet body support units mounted on the front side of the base, a second magnet body support array which comprises a plurality of second magnet body support units corresponding to the first support units and mounted on the back side of the platform at the position corresponding to the first magnet body support units, and a plurality of balance flexible cords made of flexible heat insulating material and connected between the base and the platform; and the platform is balanced and suspended below the base under combined action of an upthrust force of the first magnet body support array and the second magnet body support array as well as a downward pulling force of the balance flexible cords. According to the invention, the platform and the outside are not in direct physical contact, so as to reduce the heat exchange way of the platform and the outside to the utmost.

Description

technical field [0001] The invention relates to the field of measurement technology, in particular to a magnetic suspension heat insulation device. Background technique [0002] Thermal conductivity is also known as thermal conductivity. Its definition is given by Fourier's law: [0003] λ = - Q ΔT * L A ( W / m · K ) - - - ( 1 ) [0004] In formula (1), Q represents the heat flowing through the measured sample, L represents the length of the measured sample, ΔT represents the temperature difference between the two ends of the measured sample, and A represents the cross-sectional area of ​​the measured sample perpendicular to the heat conduction direction. Thermal conductivity λ is ...

Claims

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Application Information

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IPC IPC(8): G01N25/20
Inventor 蔡浩原崔大付李亚亭陈兴张璐璐李辉孙建海任艳飞
Owner INST OF ELECTRONICS CHINESE ACAD OF SCI
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