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Semiconductor module

A semiconductor and electrical conductor technology, applied in semiconductor devices, semiconductor/solid-state device components, electrical solid-state devices, etc., can solve problems such as difficulty in ensuring the space for pulling out lines

Inactive Publication Date: 2013-09-11
DENSO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, depending on the installation environment of the semiconductor module, it may be difficult to secure a space for the pull-out wiring on the upper surface side and / or the lower surface side of the semiconductor module.

Method used

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  • Semiconductor module
  • Semiconductor module
  • Semiconductor module

Examples

Experimental program
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Effect test

Embodiment Construction

[0015] Hereinafter, main features of the exemplary embodiments described below will be listed.

[0016] The second conductive member may have a second through hole into which the first cylindrical body is inserted, and a second extension extending outward from an outer peripheral surface of the first cylindrical body. The second protrusion may be formed on one of the outer peripheral surface of the first cylindrical body and the inner surface of the second through hole. A second recess engageable with the second protrusion may be formed on the other of the outer peripheral surface of the first cylindrical body and the inner surface of the second through hole. When the first cylindrical body is inserted into the second through hole, the second protrusion may engage with the second recess such that the second conductive member is positioned relative to the first cylindrical body. Relative to the first cylinder of the second conductive member may be provided in the circumferenti...

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Abstract

A semiconductor module (10) includes a semiconductor element (20), a case member (30), a cylindrical body (40), a lid member (50), a bus bar (60), and an insulating plate (70). The case member (30) includes a bottom member (32) and an extended portion (34). Eight protruding portions (44) are formed on an outer peripheral surface of the cylindrical body (40). Eight recessed portions are formed on an inner surface of a central hole of the bus bar (60). The protruding portions (44) of the cylindrical body (40) are engaged with the recessed portions of the bus bar (60). A direction in which an extended portion (64) of the bus bar extends is fixed in one direction, from among a plurality of directions in a circumferential direction of the cylindrical body (40), by engagement of the protruding portions (64) with the recessed portions.

Description

technical field [0001] The invention relates to a semiconductor module. Background technique [0002] When a semiconductor element generates heat, the semiconductor element and nearby members (solder, wiring, etc.) thermally expand. Stress is applied to the semiconductor element due to the difference in thermal expansion rate (ie, thermal expansion coefficient) of the members. This stress shortens the lifetime of the semiconductor element. In order to reduce such stress, research has been conducted on connecting semiconductor elements to wiring without using bonding by means of brazing filler metals such as solder. For example, Japanese Patent Application Publication No. 9-252067 (JP 9-252067 A) describes a semiconductor module in which a semiconductor element and an electrode plate are stacked together, and by pressing the semiconductor element and the electrode plate Together, the semiconductor element is connected to the electrode plate. [0003] With such a semicondu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/04H01L23/13
CPCH01L23/051H01L2224/06181H01L2224/32245H01L2924/10252H01L2924/10253H01L2924/10329H01L2924/10335H01L2924/10337H01L2924/13055H01L2924/13091H01L24/06H01L24/32H01L24/33H01L24/73H01L25/117H01L2224/33181H01L2224/50H01L2224/73263H01L2224/73213H01L2924/1306H01L2224/0603H01L2924/00H01L23/49838
Inventor 织本宪宗
Owner DENSO CORP
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