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Systems and methods for modeling through-silicon vias

A through-substrate hole and model technology, applied in special data processing applications, instruments, electrical digital data processing, etc., can solve problems such as increasing the complexity of semiconductor manufacturing and packaging

Active Publication Date: 2017-03-01
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

TSVs add complexity to semiconductor manufacturing and packaging

Method used

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  • Systems and methods for modeling through-silicon vias
  • Systems and methods for modeling through-silicon vias
  • Systems and methods for modeling through-silicon vias

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Embodiment Construction

[0040] The following description of exemplary embodiments of the invention is read with reference to the accompanying drawings that are considered a part of this entire written description. In this specification, relative terms such as "below", "above", "horizontal", "vertical", "above", "under", "above ", "below", "top" and "bottom" and their derivatives (eg, "horizontally", "downwardly", "upwardly", etc.) shall be understood to mean Orientation shown in the attached picture. These relative terms are for ease of description and do not require a particular orientation to configure or operate the device. Unless expressly described otherwise, terms attached, connected, or similar, such as "connected" and "interconnected," refer to a relationship between structures that are fixed or connected to each other, directly or indirectly through intermediate structures, and both Both are movable or rigid connections or relationships.

[0041] Apparatus and methods for modeling and sim...

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Abstract

A computer implemented system comprises a processor programmed to analyze a circuit to determine a response of the circuit to an input radio frequency (RF) signal, for at least one of designing, manufacturing, and testing the circuit. An interposer model is tangibly embodied in a non-transitory machine readable storage medium to be accessed by the processor. The interposer model is processed by the computer to output data representing a response of a though substrate via (TSV) to the radio frequency (RF) signal. The interposer model comprises a plurality of TSV models. Each TSV model has a respective three-port network. One of the ports of each three-port network is a floating node. The floating nodes of each of the three-port networks are connected to each other.

Description

technical field [0001] The invention relates to modeling for integrated circuits and simulation devices for integrated circuits. Background technique [0002] Integrated ("IC") circuits form part of many electronic devices. Advances in IC packaging technology have allowed multiple ICs to be stacked vertically in so-called three-dimensional ("3D") packages in order to save horizontal area on a printed circuit board ("PCB"). An alternative packaging technology known as 2.5D packaging may use an interposer, which may be formed from a semiconductor material (eg, silicon) used to connect the die or dies to the PCB. Multiple IC chips, which may be of various technologies, are mounted on the interposer. Connections in various ICs are routed through conductive patterns in the interposer. Due to the resistance and capacitance ("RC") of the semiconductor substrate, the interposer affects the operating characteristics of an IC bonded or otherwise connected to the interposer. [000...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F17/50H01L21/768
CPCG06F30/367H01L23/49827H01L2224/13H01L2224/16225H01L2924/15311
Inventor 颜孝璁林佑霖郭晋玮
Owner TAIWAN SEMICON MFG CO LTD