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Substrate for power module

A technology of power modules and substrates, applied in semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve problems such as heat generation and damage to overall module performance

Inactive Publication Date: 2013-09-18
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, higher integration of power modules can cause problems such as heat generation in electronic components and damage the performance of the overall module

Method used

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  • Substrate for power module
  • Substrate for power module
  • Substrate for power module

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Embodiment Construction

[0030] The objects, features and advantages of the present invention will be more clearly understood from the preferred embodiments described in detail below in conjunction with the accompanying drawings. In the drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations thereof are omitted. Also, in the following description, the terms "first", "second", "one side", "the other side" and similar words are used to distinguish a particular device from other devices, however, the structure of these devices Not limited to these terms. Also, in the description of the present invention, when it is determined that the detailed description of the related art would obscure the gist of the present invention, its description will be omitted.

[0031] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0032] Substrate for power module - first emb...

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Abstract

Disclosed herein is a substrate for a power module. The substrate may include a metal base substrate, an insulating layer formed on the metal base substrate and including a plurality of insulating adhesion layers and a ceramic filler layer formed on a joining interface between the plurality of insulating adhesion layers, and a circuit layer formed on the insulating layer. The substrate for the power module has a high heat conductivity coefficient, thereby raising heat dissipation efficiency.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to Korean Patent Application No. 10-2012-0024043, filed Mar. 8, 2012, entitled "Substrate for Power Module," which is hereby incorporated in its entirety This application is incorporated by reference. technical field [0003] The invention relates to a substrate for a power module. Background technique [0004] With the increase in energy consumption throughout the world, efficient use of limited energy has drawn significant attention. Therefore, inverters of smart power modules for efficiently converting energy in existing consumer / industrial products have been applied, and have been adopted in an accelerated manner. [0005] Meanwhile, as disclosed in Patent Document 1, power modules with various structures are gradually being used, and the market requires power modules with higher integration, higher capacity and miniaturization. As a result, higher integration of power modules ca...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/433H01L23/14
CPCH01L23/3735H01L23/3737H01L2924/0002H01L2924/00H01L21/84H01L27/12
Inventor 金洸洙李荣基舒范锡
Owner SAMSUNG ELECTRO MECHANICS CO LTD