Punching mold and punching method
A stamping and mold technology, applied in the field of molds, can solve the problems of reducing the production efficiency of circuit board substrates, wasting manpower, increasing the cost of circuit board production, etc.
Active Publication Date: 2015-07-01
HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD +1
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Problems solved by technology
[0003] However, during the stamping process of the circuit board substrate by the plurality of annular punching knives, the parts of the plurality of circuit board substrates punched by the plurality of annular punching knives are not easy to be separated from the corresponding annular If it falls from the punching knife, it is easy to get stuck in the corresponding ring punching knife. It is necessary to manually remove the punched circuit board substrate part from the corresponding ring punching knife, which not only wastes manpower, but also reduces the cost of the circuit board. The production efficiency of the substrate, but also increases the production cost of the circuit board with the circuit board substrate
Method used
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[0043] The punching die provided by the technical solution and the punching method using the punching die will be described in detail below by taking the manufacture of the base material pre-product 100 as an example with reference to a plurality of drawings and embodiments.
[0044] see figure 1 , the base material preform 100 includes at least one main body area 101 , a waste area 102 surrounding the main body area 101 , a plurality of micro-connections 103 connected between the main body area 101 and the waste area 102 , and between the main body area 101 and the waste area 102 A plurality of through holes 111 , 112 , 113 , 114 , 115 , 116 and 117 therebetween. Each via is located between two adjacent micro-connections 103 . The plurality of micro-connections 103 and the plurality of vias 111 - 117 define the shape of the body region 101 and also separate the body region 101 from the waste region 102 . The number of main body regions 101 is not limited. In this embodiment...
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The invention relates to a punching mold used for forming a substrate prefabricating product. The substrate prefabricating product comprises a main body area, a waste area surrounding the main body area, a plurality of micro connecting parts and a plurality of through holes, wherein each through hole is located between every two adjacent micro connecting parts; the punching mold comprises a first sub-punching mold and a second sub-punching mold; the first sub-punching mold is provided with at least one first punching cutter, and the first punching cutter comprises a plurality of first punching knives which are mutually separated and used for punching a part of an edge of each through hole; the second sub-punching mold is provided with at least one second punching cutter, and the second punching cutter comprises a plurality of second punching knives which are mutually separated and used for punching other parts of an edge of each through hole; and the plurality of second punching knives and the plurality of first punching knives correspond in a matching manner and are used for forming a plurality of punching rings which are closed and mutually separated in a matching manner, so that the plurality of through holes are punched and formed. The invention further relates to a punching method adopting the punching mold.
Description
technical field [0001] The invention relates to the technical field of molds, in particular to a punching die and a punching method using the punching die. Background technique [0002] In the information, communication and consumer electronics industries, circuit boards are an indispensable basic component of all electronic products. The manufacturing process of the circuit board includes the step of forming. Forming refers to die-cutting or punching a predetermined area of a circuit board substrate with a punching die to form a circuit board substrate with a predetermined external size. The punching die is generally a steel die and includes a plurality of phase-separated annular punching knives. The plurality of annular punching knives are used for punching the circuit board base material, so as to form a plurality of through holes corresponding to the plurality of annular punching knives one-to-one on the circuit board base material. [0003] However, in the process ...
Claims
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IPC IPC(8): B26F1/14
Inventor 冀萃平权周代峰
Owner HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD