Semiconductor packaging part and manufacturing method thereof
A semiconductor and packaging technology, applied in the field of semiconductor packaging and its manufacturing, can solve the problems of increasing manufacturing costs and separate manufacturing processes, and achieve the effects of preventing electromagnetic wave interference, simplifying the structure, and reducing manufacturing costs
Inactive Publication Date: 2013-10-16
SAMSUNG SEMICON CHINA RES & DEV +1
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Problems solved by technology
[0005] That is, according to the semiconductor package of the prior art, in order to prevent electromagnetic interference, it is necessary to form a separate shielding layer 16 on the outer surface of the encapsulation resin 15, thereby requiring a separate manufacturing process, increasing the manufacturing cost
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[0017] Hereinafter, a semiconductor package according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.
[0018] figure 2 is a sectional view of the semiconductor package according to the first exemplary embodiment of the present invention. refer to figure 2 , the semiconductor package according to the first exemplary embodiment of the present invention includes: a substrate 100; a chip 130, located on the substrate 100, attached to the substrate 100 through an adhesive layer 150; a conductive structure 140, dispersed in the adhesive layer 150, the The chip 130 is electrically connected to the conductive pads in the substrate 100; the conductive molding compound 160 encapsulates the chip 130 to protect the chip 130 from external damage; the conductive solder balls are located below the substrate 100 and are used to electrically connect the chip 130 to external circuitry.
[0019] According to the first exemp...
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The invention provides a semiconductor packaging part and a manufacturing method thereof. The semiconductor packaging part comprises a substrate, a chip positioned on the substrate, a bonding layer placed between the substrate and the chip, a conductive structure dispersed in the bonding layer and a conductive molding compound, wherein the chip is attached to the substrate via the bonding layer, the chip is electrically connected with the substrate via the conductive structure, and the conductive molding compound packages the chip and is connected to the ground. According to the semiconductor packaging part of the invention, the chip is prevented from interference of electromagnetic waves, and extra technology is not required.
Description
technical field [0001] The present application relates to a semiconductor package and a manufacturing method thereof, and more specifically, the present application relates to a semiconductor package with improved electromagnetic wave shielding, signal integrity and heat dissipation effects and a manufacturing method thereof. Background technique [0002] For many integrated circuit chips, high frequency signals are increasingly used. However, high frequency signals are often accompanied by issues of signal integrity and electromagnetic wave shielding. In addition, for semiconductor packages with high power consumption, how to dissipate heat is also a difficult problem. For example, in the prior art, heat dissipating glue and the like are often used to dissipate heat. [0003] figure 1 is a schematic diagram of a semiconductor package according to the prior art. refer to figure 1 , the semiconductor package according to the prior art includes: a substrate 10; a chip 11, ...
Claims
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Login to View More IPC IPC(8): H01L23/552H01L23/367
CPCH01L24/73H01L2224/16225H01L2224/32225H01L2224/48091H01L2224/48145H01L2224/48147H01L2224/73204H01L2224/73265H01L2224/8592H01L2924/15311H01L2924/181
Inventor 陈峥嵘
Owner SAMSUNG SEMICON CHINA RES & DEV