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Manufacturing method of light emitting diode packaging structure

A technology for light-emitting diodes and packaging structures, which is applied to electrical components, circuits, semiconductor devices, etc., can solve the problems of uneven distribution of phosphors, affecting the light-emitting effect of light-emitting diode packaging structures, etc., and achieve the effects of uniform distribution and simple production process.

Inactive Publication Date: 2013-10-23
ZHANJING TECH SHENZHEN +1
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AI Technical Summary

Problems solved by technology

Phosphor powder is usually sprayed on the light-emitting surface of the encapsulant, but the randomness of spraying can easily lead to uneven distribution of phosphor powder
In addition, the phosphor powder can also be mixed in the encapsulant material before the encapsulant is dispensed, and the phosphor powder suspended in the encapsulant material will deposit when the encapsulant material is solidified, which will also cause fluorescence in the cured encapsulant. Powder distribution is uneven, which affects the final light-emitting effect of the LED packaging structure

Method used

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  • Manufacturing method of light emitting diode packaging structure
  • Manufacturing method of light emitting diode packaging structure
  • Manufacturing method of light emitting diode packaging structure

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Embodiment Construction

[0018] Such as Figure 7 As shown, the light emitting diode packaging structure 100 provided by the embodiment of the present invention includes a substrate 10, a circuit structure 20 formed on the substrate 10, a light emitting diode chip 30 carried on the substrate 10 and electrically connected to the circuit structure 20, and the packaging structure The fluorescent encapsulation layer 40 of the LED chip 30 .

[0019] In this embodiment, a groove 15 is formed on the substrate 10 , the bottom of the groove 15 is a bottom plate 151 and the surrounding is a side wall 152 . The circuit structure 20 is disposed on the base plate 151 . The light emitting diode chip 30 is accommodated in the groove 15 , and is fixed and electrically connected to the circuit structure 20 of the substrate 10 in a flip-chip manner. The LED chip 30 includes a light emitting surface 31 opposite to the substrate 10 , and two electrodes 32 are disposed on the other surface opposite to the light emitting...

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Abstract

The invention provides a manufacturing method of a light emitting diode packaging structure. The method comprises the steps of providing a packaging substrate, and forming a plurality of grooves in the substrate; forming a circuit structure at the bottom surface of the groove; arranging a light emitting diode chip in the groove and electrically connecting the light emitting diode chip to the circuit structure at the bottom part of the groove; providing a fluorescent packaging layer and arranging the fluorescent packaging layer on the substrate; pressing the fluorescent packaging layer into the grooves by adopting a thermal pressing mode, thereby enabling fluorescent powder to be uniformly distributed. The manufacturing process is simple and convenient.

Description

technical field [0001] The invention relates to a semiconductor manufacturing method, in particular to a manufacturing method of a light emitting diode packaging structure. Background technique [0002] Compared with traditional light sources, light emitting diodes (Light Emitting Diode, LED) have the advantages of light weight, small size, low pollution, long life, etc. As a new type of light source, it has been increasingly used in In various fields, such as street lights, traffic lights, signal lights, spotlights and decorative lights. [0003] Existing LED packaging structures generally include a substrate, electrodes on the substrate, LED chips carried on the substrate and electrically connected to the electrodes, and a package covering the LED chips. In order to improve the luminous characteristics of the light emitting diode chip, phosphor powder is usually arranged in the packaging structure of the light emitting diode. Phosphor powder is usually coated on the ligh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/50
Inventor 罗杏芬
Owner ZHANJING TECH SHENZHEN
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