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Power supply module

A technology for power modules and electronic devices, applied in electrical components, printed circuit board sockets, electrical equipment structural parts, etc., can solve the problem of increasing the number of components, and achieve the effect of reducing the number of components

Active Publication Date: 2013-10-23
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the housing case 500 described in Patent Document 1 requires two components, the upper case 504 and the lower case 506, which has a problem of increasing the number of parts.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] Hereinafter, a power supply module according to an embodiment of the present invention will be described.

[0033] (Structure of Power Module)

[0034] Hereinafter, the configuration of a power module according to an embodiment will be described with reference to the drawings. figure 1 It is an external perspective view of the power module 10 according to one embodiment. figure 2 yes figure 1 Five side view of the power module 10. image 3 yes figure 1 An exploded view of the power module 10 of FIG. Below, will figure 1 The up and down directions in are simply referred to as "up and down directions". In addition, in figure 1 When viewed from above, the direction in which the short side of the power module 10 extends is defined as the front-rear direction, and the direction in which the long side of the power module 10 extends is defined as the left-right direction.

[0035] The power supply module 10 is a power supply circuit of a DC power supply or an AC ...

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PUM

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Abstract

A power supply module including fewer components comprises a circuit board (14) and a heatsink plate (12). The circuit board (14) has a first principal surface (S1), a second principal surface (S2), and side surfaces (S3-S6). Electronic components (50, 52) are mounted on the first principal surface (S1). The heatsink plate (12) has a plate-like body portion (20) that faces the first principal surface (S1), and a plurality of fixing portions (22) that extend at an angle from the body portion (20) to face the side surfaces (S3, S5). The fixing portions (22) are configured to come into contact with the second principal surface (S2) to secure the body portion (20) to the circuit board (14).

Description

technical field [0001] The present invention relates to a power module, and more specifically, to a power module including a circuit board on which electronic components are mounted. Background technique [0002] As an invention related to a conventional power module, for example, an electronic device housing case described in Patent Document 1 is known. Figure 4 It is a cross-sectional structural view of the housing case 500 of the electronic device described in Patent Document 1. [0003] The housing case 500 includes an upper case 504 and a lower case 506 , and accommodates a printed circuit board 502 . The upper case 504 is disposed on the upper side of the printed substrate 502 . The lower case 506 is disposed on the lower side of the printed circuit board 502 . Furthermore, the upper case 504 sandwiches the printed circuit board 502 and the lower case 506 from the vertical direction. Thereby, the printed circuit board 502, the upper case 504, and the lower case 506...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH02B1/56H05K7/209H05K7/1432
Inventor 长井淳坪野正则
Owner MURATA MFG CO LTD