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Electronic component mounting device

An electronic component installation and electronic component technology, applied in the direction of electrical components, electrical components, etc., can solve the problems of unstable adsorption of electronic components and shortening the residence time.

Active Publication Date: 2017-05-03
YAMAHA MOTOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, if the residence time of the suction nozzle is shortened when the electronic component is picked up and taken out from the component supply device, and the suction nozzle is raised before the vacuum pressure for suction increases, the suction of the electronic component becomes unstable.

Method used

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  • Electronic component mounting device
  • Electronic component mounting device

Examples

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Embodiment Construction

[0038] The following is based on figure 1 , an embodiment of the present invention will be described with respect to an electronic component mounting apparatus 1 that mounts electronic components on a printed circuit board P that is a circuit board. The electronic component mounting apparatus 1 is provided with a conveyance device 2 for conveying printed circuit boards P side by side, and component supply devices 3A and 3B which are arranged on the front side and the rear side of the main body of the device and supply electronic components. A pair of arms 4A, 4B that move in one direction (reciprocating in the Y direction), and a mounting head 6A that is individually movable in a direction along the arms 4A, 4B by each driving source, each having a suction nozzle 5 (head number "1"), 6B (head number "2").

[0039] The conveying device 2 includes a supply conveyor (conveyer) 2A, a positioning unit 2B for positioning and fixing the printed circuit board P, and a discharge conve...

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PUM

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Abstract

PROBLEM TO BE SOLVED: To stabilize sucking of an electronic component with a suction nozzle when the electronic component is taken out of a component supply device.SOLUTION: An electronic component loading device includes: a standby time timer 42 for, when recognition processing is operated of an electronic component held by a suction nozzle 5 of one loading head 6A or 6B accompanied by loading of the electronic component to a first substrate, counting time for each cycle during which the one loading head 6A or 6B is in standby because the other loading head 6B or 6A is loading an electronic component; a storage device 17 for storing the standby time counted by the timer 42; and a control device 15 for, in the same cycle as the cycle, in which the suction nozzle 5 is lowered of one loading head 6A or 6B accompanied by loading to a second or later substrate to take an electronic component out of a component supply unit, controlling the suction nozzle 5 to be retained for retention time which is acquired by adding suction retention time in which the suction nozzle 5 is retained, to time acquired by dividing the standby time stored in the storage device 17 by the loading number of electronic components in the cycle.

Description

technical field [0001] The present invention relates to an electronic component mounting device, which is provided with two mounting heads for taking out electronic components from a component supplying device, taking out electronic components from the component supplying device through a plurality of suction nozzles provided in each mounting head, and photographing them with a component recognition camera The electronic components held by the suction nozzle are identified and processed, each identification result is added to the mounting coordinates of each electronic component, and the electronic components are respectively mounted on the circuit board. Background technique [0002] Such an electronic component mounting device is disclosed in, for example, Patent Document 1 or the like. Electronic components are mounted on a printed circuit board with high precision in such an electronic component mounting apparatus. [0003] [Patent Document 1] (Japanese) Unexamined Pate...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04
Inventor 亀田真希夫泉原弘一
Owner YAMAHA MOTOR CO LTD