Device for Measuring the Electrostatic Force of an Electrostatic Chuck
An electrostatic chuck and electrostatic force technology, applied in the field of electrostatic force devices, can solve problems such as roughness and inability to guarantee measurement results, and achieve the effects of improving installation efficiency, facilitating replacement or maintenance, and improving production efficiency and quality
Active Publication Date: 2015-10-28
TSINGHUA UNIV
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Problems solved by technology
However, the electrostatic force decreases gradually and smoothly with the increase of the gap, and does not suddenly decrease to zero or a small value. Therefore, the use of this criterion is ambiguous and very rough, and it cannot be guaranteed that the measurement result is that the wafer is in the adsorption state. The magnitude of the electrostatic force
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[0023] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.
[0024] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation or position indicated by "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. The relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the descrip...
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The invention discloses a device for measuring electrostatic force of an electrostatic chuck. The device comprises a vacuum cavity, the electrostatic chuck, a force cell, a power device and a distance measurement sensor. Specifically, the electrostatic chuck is arranged in the vacuum cavity, the force cell is movably arranged in the vacuum cavity in the direction close to the electrostatic chuck and the direction away from the electrostatic chuck and is suitable for being connected with a wafer, the power device is arranged on the vacuum cavity and is connected with the force cell, and the distance measurement sensor is arranged in the vacuum cavity. According to the device for measuring the electrostatic force of the electrostatic chuck, more complete and more precise data can be acquired; in the process that the electrostatic chuck is adopted for generating an integrated circuit, the electrostatic force can be effectively adjusted, and accordingly production efficiency and quality can be improved.
Description
technical field [0001] The invention relates to the technical field of integrated circuit manufacturing equipment design, in particular to a device for measuring the electrostatic force of an electrostatic chuck. Background technique [0002] Electrostatic chuck (ESC or E-chuck for short) is a common component in IC manufacturing processes such as etching, photolithography, PVD, CVD, ion implantation, etc. Its core function is to generate electrostatic force through internal electrostatic electrodes. The wafer is evenly adsorbed on its upper surface for IC process. The size and distribution of the electrostatic force generated by the electrostatic chuck affects the flatness and temperature distribution of the wafer, which has a great impact on the performance of the IC process. Therefore, the detection of the size and distribution of the electrostatic force is important in the optimization and control of the process. the part that can not be lost. It is necessary to design...
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IPC IPC(8): H01L21/66
Inventor 程嘉曹明路季林红
Owner TSINGHUA UNIV