Multi-wire cutting machine guide wheel wire groove and its processing method

Abstract

The invention discloses a multi-wire cutting machine guide wheel wire groove and a machining method of the multi-wire cutting machine guide wheel wire groove. A left straight side portion and a right straight side portion are formed by a multi-wire cutting machine guide wheel on the basis of each traditional V-shaped groove, wherein each left straight side portion and each right straight side portion are parallel to the center line of one wire groove. According to the structure, the axial width of each V-shaped groove is reduced, even under the action of the axial acting force F, the cutting steel wire is prevented from generating transitional axial deviation, and therefore the defects of line marks, steps and the like generated on the surface of a crystal slice are reduced. In addition, the cutting steel wire is completely contained in each wire groove through one left straight side portion and one right straight side portion located at the two sides of one V-shaped groove. A component force FS, generated on the side wall of each V-shaped wire groove, of the axial acting force F is weakened due to the fact that the component force FS is restrained by the extrusion force of one left straight side portion or one right straight side portion, so that the difficulty for the cutting steel wire to move towards each groove top is increased, the wire jumping accident of the cutting steel wire is avoided, and therefore the slice quality of the crystal slice in the whole process of production is guaranteed.

Description

technical field [0001] The invention relates to the field of slicing production of semiconductor crystal ingots in the photovoltaic industry, in particular to a guide wheel groove of a multi-wire cutting machine for cutting large-size crystal silicon rods and other semiconductor crystal ingots and a processing method thereof. Background technique [0002] When manufacturing various semiconductors and photovoltaic devices, semiconductor ingots containing hard and brittle materials such as silicon, sapphire, and ceramics are cut and processed into wafers of required thickness. Since wafer dicing is an important process that restricts subsequent finished products, the requirements for its processing are getting higher and higher. At present, multi-wire cutting technology is widely used in the production of crystal slices in the photovoltaic industry due to its high production efficiency, low processing cost, and high processing accuracy. [0003] A pair of guide wheels paralle...

AI Technical Summary

Problems solved by technology

Once the cutting wire 400 moves axially on the cutting path, it will inevitably cause defects such as grooves, line marks or steps on the wafer surface on the cutting path, thereby affecting the quality of the crystal rod section

Additionally, in the above F S Under the action of component force, the cutting steel wire 400 is easy to move to the top of the groove and break away from the wire groove 110, resulting in the accident of "jumping wire" of the cutting wire, which affects the overall slicing quality of crystal slices

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