Camera module, dust prevention and fixing method and installation method of camera module

A camera module and component technology, applied in electrical components, image communication, color TV parts, etc., can solve the problems that passive components are easy to hide foreign objects, easy to fall off, etc.

Inactive Publication Date: 2013-11-20
NANCHANG O FILM OPTICAL ELECTRONICS TECH CO LTD +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Based on this, it is necessary to provide a camera module for the problems that foreign objects are easily hidden between passive components and easy to fall off during vibration.
[0004] At the same time, in view of the problems that foreign objects are easily hidden between passive components and easy to fall off during vibration, a firmware method for camera modules is provided
[0005] And aiming at the problems that foreign matter is easy to be hidden between passive components and easy to fall off during vibration, a method for installing a camera module is provided

Method used

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  • Camera module, dust prevention and fixing method and installation method of camera module
  • Camera module, dust prevention and fixing method and installation method of camera module
  • Camera module, dust prevention and fixing method and installation method of camera module

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Embodiment Construction

[0028] In order to facilitate the understanding of the present invention, the camera module and its dust-proof firmware method and its installation method will be more fully described below with reference to the relevant drawings. The preferred embodiments of the camera module and its dust-proof firmware method and its installation method are given in the accompanying drawings. However, the camera module and its anti-dust firmware method and its installation method can be implemented in many different forms, and are not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the camera module and its dust-proof firmware method and its installation method more thorough and comprehensive.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terminology used he...

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Abstract

The invention relates to a camera module, a dust prevention and fixing method and an installation method of the camera module, wherein the camera module comprises a circuit board, a plurality of passive elements and adhesive layers, wherein the passive elements are fixedly arranged on the circuit board; the adhesive layers cover the surfaces of the passive elements; the adhesive layers are filled in gaps among the passive elements. The dust prevention and fixing method comprises the following steps: dispensing adhesive on the surfaces of the passive elements of the camera module to form the adhesive layers; filling the gaps among the passive elements with the adhesive layers. The installation method of the camera module comprises the following steps: after applying gold threads, before mounting a bracket, dispensing adhesive on a circuit board area attached below the bracket and the surfaces of the passive elements of the camera module to form the adhesive layers; filling the gaps among the passive elements with the adhesive layers. The camera module, the dust prevention and fixing method and the installation method of the camera module can solve the problem that foreign matters are easily hidden among passive elements and easily fall down during vibration.

Description

technical field [0001] The invention relates to the technical field of image communication, in particular to a camera module, a dustproof firmware method for the camera module, and a method for installing the camera module. Background technique [0002] General camera modules for mobile phones, tablet computers, etc., are composed of components such as lenses, voice coil motors, filters, sensors, passive components, and circuit boards. Most of the passive components are placed on the circuit board, and there are gaps between the passive components, which are easy to hide foreign objects such as dust and tin slag, which will cause hidden dangers of bad images on the module. Moreover, during the vibration process, there is a risk of the passive components falling off. Contents of the invention [0003] Based on this, it is necessary to provide a camera module for the problems that foreign matter is easy to be hidden between passive components and easy to fall off during vib...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/225G03B17/12
Inventor 刘燕妮
Owner NANCHANG O FILM OPTICAL ELECTRONICS TECH CO LTD
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