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Inner core plate of sandwich plate and lamination error proof method of sandwich plate

A technology of inner-layer core board and multi-layer board, which is applied in the direction of multi-layer circuit manufacturing, printed circuit components, etc., can solve the problems of reverse inner-layer core board, negative impact on company reputation, compensation, etc., to prevent over-laying, Avoid outflow, improve the effect of quality

Active Publication Date: 2013-11-27
东莞市若美电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is inevitable that there will be more, less, misplaced or reversed inner core boards. Once the factory fails to find out in time, it will have a serious negative impact on the company's reputation and even lead to compensation if it flows into the hands of customers.

Method used

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  • Inner core plate of sandwich plate and lamination error proof method of sandwich plate
  • Inner core plate of sandwich plate and lamination error proof method of sandwich plate
  • Inner core plate of sandwich plate and lamination error proof method of sandwich plate

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Embodiment Construction

[0025] In order to make the object, technical solution and advantages of the invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0026] Such as Figures 1 to 5 As shown, an inner core board of a multi-layer board, the inner core board 6 is provided with an inner core board inspection area 1, and the inner layer core board inspection area 1 includes n-2 inner layers arranged in sequence Core board layer marking area 2, the n-1th layer board is provided with a board layer number 3 and a board layer detection copper strip 4 in the n-2th inner layer core board layer marking area 2; n is the number of the multi-layer board The number of layers, and n is greater than 3. figure 1 It is a schematic diagram of the structure of the fourth inner layer core board of the eight-layer board.

[0027] The inner layer core board of the multilayer board of the present invention is provided with an ...

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Abstract

The invention relates to the technical field of processing of PCBs, in particular to an inner core plate of a sandwich plate and a lamination error proof method of the sandwich plate. The inner core plate is provided with an inner core plate inspection area which comprises n-2 layer sign areas of the inner core plate arranged in sequence, the (n-1)th layer plate is provided with a plate layer serial number and a plate layer detection copper bar in the (n-2)th inner layer core plate layer sign area, the n stands for the layer number of the sandwich plate, and the n is larger than 3. The sandwich plate manufactured by adopting the inner core plates is provided with the inner core plate inspection area, stacking up of the inner core plates and inspection after lamination in a lamination procedure of the sandwich plate are facilitated, the situations that the inner core plates are place more or less or reversely are avoided effectively, the fact that bad products caused by stacking errors flow into customers is avoided, quality of products is improved, and outflow of bad products is avoided.

Description

technical field [0001] The invention relates to the technical field of PCB board processing, in particular to an inner core board of a multilayer board and a lamination error prevention method for the multilayer board. Background technique [0002] The rapid development of the electronics industry in the world today has also prompted the printed circuit industry, the leading industry in the electronics industry, to continuously improve its technical level, with higher and higher wiring densities; thinner lines; and more and more layers of boards. These issues have presented severe challenges to PCB manufacturers. The increase in the number of layers of the board also puts forward higher requirements for the key process of multi-layer board production-the lamination process. The lamination process needs to realize the orderly combination of multiple inner core boards. Most enterprises currently use riveting or fusion or PLN LAM methods, which are manual or semi-automatic ope...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/46
Inventor 洪少鸿张勇
Owner 东莞市若美电子科技有限公司
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