Microfluidic Chip Combiner
A technology of microfluidic chips and laminators, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of inability to bond the cover plate and the substrate, poor bonding strength, and large area, and achieve curing. Good gloss, low cost and high efficiency
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[0027] Below in conjunction with embodiment the present invention is described in further detail:
[0028] Microfluidic chip combiner, such as figure 1 As shown, it includes a base 1, a curing device, a positioning plate, a vacuum pressurizing device, and a control mechanism.
[0029] The base 1 is as figure 1 Cabinet structure shown. A square slot hole is provided at the center of the top of the base 1 , and the size of the slot hole is slightly larger than or equal to the size of the substrate and the cover to be combined. The lower part of the base 1 is provided with a heat dissipation fan 2 for dissipating heat from the curing device in the slot. An induction door is provided on the outside of the base 1 to provide an effective and clean environment for the laminating process.
[0030] The curing device is arranged in the slot hole. A number of UV curing lamps 3 are installed on the inner bottom of the slot for irradiating the bonding adhesive with high-intensity char...
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