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Semiconductor package

A package and semiconductor technology, which is applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve problems such as the increase in the size of semiconductor packages

Inactive Publication Date: 2014-01-15
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the size of the semiconductor package also increases

Method used

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  • Semiconductor package
  • Semiconductor package
  • Semiconductor package

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Embodiment Construction

[0032] Embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, this invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0033] In the drawings, the shapes and dimensions of elements may be exaggerated for clarity, and the same reference numerals will be used throughout to designate the same or like elements.

[0034] Terms related to orientation will be defined first. The outward or inward radial direction refers to the direction from the center of the molded part 140 toward the outer surface of the molded part 140 or the direction opposite thereto, and the upward or downward direction refers to the direction from the heat dissipation member 150 toward the lead wires. T...

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Abstract

There is provided a semiconductor package including: an internal lead having at least one electronic component mounted on a surface thereof; a heat sink disposed below the internal lead; a molded portion sealing the at least one electronic component, the internal lead and the heat sink; an external lead extended from the internal lead and protruding outwardly from the molded portion in a radial direction; a heat radiating member attached to the heat sink and a surface of the molded portion; and an insulating coating film formed on a surface of the external lead.

Description

[0001] This application claims priority from Korean Patent Application No. 10-2012-0070565 filed with the Korean Intellectual Property Office on Jun. 29, 2012, the disclosure of which is incorporated herein by reference. technical field [0002] The present invention relates to a semiconductor package, and more particularly, to a semiconductor package with improved insulation characteristics. Background technique [0003] The semiconductor package includes a lead frame on which the power semiconductor element is mounted, a power semiconductor element mounted on the lead frame, and a molding portion that molds the exterior of each element using resin or the like. [0004] Generally, a heat sink is used to dissipate heat generated due to high voltage applied to the semiconductor package from the outside. However, in the case of adding a heat sink to the semiconductor package, an electrical short may occur between the lead frame and the heat sink. [0005] Therefore, a predete...

Claims

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Application Information

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IPC IPC(8): H01L23/31H01L23/495H01L23/36
CPCH01L23/24H01L23/3107H01L23/3135H01L23/4334H01L23/49555H01L23/49575H01L23/49586H01L2224/48137H01L2224/48091H01L2224/48247H01L2224/73265H01L2224/32245H01L2924/00014H01L2924/00012H01L23/498H01L2924/00
Inventor 河兆富
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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