Embedded resistance alloy material, embedded resistance film and preparation method thereof
A technology of embedded resistors and thin films, which is applied in the application of resistive materials, metal material coating processes, resistors, etc., can solve the problems of poor corrosion resistance, thermal stability and anti-aging performance.
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[0039] see figure 1 , the preparation method of the embedded resistive film of one embodiment, comprises the following steps:
[0040] Step S110 : providing a substrate, and activating the substrate.
[0041] The substrate can be copper foil, aluminum foil or aluminum-magnesium alloy, etc., preferably copper foil. It is preferable to form an embedded resistive film on the rough surface of the copper foil.
[0042] First, the substrate is activated to deposit a buried resistance alloy material on the surface of the activated substrate to form a buried resistance film stacked on the surface of the substrate.
[0043] Preferably, the substrate is soaked in an activator at a temperature of 20° C.˜60° C. for 1 minute to 10 minutes, so as to activate the surface of the substrate.
[0044] The activator is preferably an activator containing 20-120 grams of zinc sulfate, 10-50 grams of DL-sodium malate and 5-30 grams of zinc powder per liter.
[0045] After activation by the above...
Embodiment 1
[0072] 1. Provide a copper foil with a relatively smooth surface and a rough surface as a substrate, paste a protective film on the smooth surface of the copper foil, wash the copper foil with acetone, and then soak it in an alkaline solution with a temperature of 50 °C 5 minutes, take out, wash with deionized water; wherein, the alkaline solution is a mixed aqueous solution of sodium hydroxide, sodium carbonate and sodium phosphate, the concentration of sodium hydroxide is 30g / L, the concentration of sodium carbonate is 30g / L, phosphoric acid The concentration of sodium is 30g / L;
[0073] 2. Immerse the sample obtained in step 1 in dilute sulfuric acid with a mass fraction of 5% for pickling for 5 minutes, take out and wash with deionized water;
[0074] 3. Immerse the sample obtained in step 2 in 200 mL of activator with a temperature of 40°C, let stand for 10 minutes for activation, take out and wash with deionized water; wherein, 200 mL of activator contains 24 g of zinc s...
Embodiment 2
[0080] 1. Provide a copper foil with a relatively smooth surface and a rough surface as the substrate, paste a protective film on the smooth surface of the copper foil, wash the copper foil with acetone, and then soak it in an alkaline solution with a temperature of 30 °C 10 minutes, take out, wash with deionized water; wherein, the alkaline solution is a mixed aqueous solution of sodium hydroxide, sodium carbonate and sodium phosphate, the concentration of sodium hydroxide is 30g / L, the concentration of sodium carbonate is 30g / L, phosphoric acid The concentration of sodium is 30g / L;
[0081] 2. Immerse the sample obtained in step 1 in dilute sulfuric acid with a mass fraction of 5% for pickling for 5 minutes, take out and wash with deionized water;
[0082] 3. Immerse the sample obtained in step 2 in 200 mL of activator with a temperature of 30°C, stand for 10 minutes for activation, take out and wash with deionized water; wherein, 200 mL of activator contains 24 g of zinc su...
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Abstract
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