Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Vacuum evaporation device

An evaporation and vacuum technology, applied in the directions of vacuum evaporation coating, sputtering coating, ion implantation coating, etc., can solve the problem of uneven coating thickness and achieve the effect of uniform coating thickness and ensuring uniformity

Active Publication Date: 2014-01-29
BOE TECH GRP CO LTD
View PDF4 Cites 15 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problem of uneven thickness of the coating film formed by the vacuum evaporation device in the prior art, and to provide a vacuum evaporation device capable of forming uniform thickness

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Vacuum evaporation device
  • Vacuum evaporation device
  • Vacuum evaporation device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Such as Figure 3-5 As shown, this embodiment provides a vacuum evaporation device.

[0036] Such as image 3 As shown, the vacuum evaporation device includes an evaporation chamber 5, an evaporation source device 10 arranged in the central area of ​​the bottom plate 1 of the evaporation chamber 5, and a baffle assembly for preventing evaporation substances from contaminating the inner surface of the evaporation chamber 5 20 ; the baffle assembly 20 has a baffle assembly opening 200 corresponding to the position of the evaporation source device 10 .

[0037] The substrate 4 to be evaporated is placed on the upper part of the evaporation chamber 5, and the evaporation material of the evaporation source device 10 is evaporated on the plane of the entire substrate 4 through the opening 200 of the baffle assembly, and the size of the opening 200 of the baffle assembly can prevent evaporation. The substance contaminates the inner surface of the evaporation chamber 5 .

[...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a vacuum evaporation device, which belongs to the field of vacuum evaporation and can be used for effectively solving a problem that thickness of a coating film formed by the existing vacuum evaporation device is not uniform. The vacuum evaporation device comprises an evaporation chamber, an evaporation source device arranged in the evaporation chamber, and a baffle plate assembly arranged between the evaporation source device and a to-be-evaporated base plate, wherein the evaporation source device is arranged on the center area of the evaporation chamber; the baffle plate assembly is provided with a baffle plate assembly opening which is corresponding to the position of the evaporation source device and used for passing through evaporated substances. The evaporation source device is arranged on the center area of the bottom plate of the evaporation chamber, and the thickness of the coating film on the base plate is more uniform.

Description

technical field [0001] The invention belongs to the field of vacuum evaporation, and in particular relates to a vacuum evaporation device. Background technique [0002] Such as figure 1 As shown, the vacuum evaporation equipment of the prior art includes an evaporation chamber 5 and a bottom plate 1 positioned at the bottom of the evaporation chamber 5, the substrate 4 to be evaporated is placed on the top of the evaporation chamber 5, and on the bottom of the bottom plate 1 An evaporation source device 10 is provided at the edge, and a baffle 3 is provided in the middle of the evaporation chamber 5, and the baffle opening 31 of the baffle 3 is set corresponding to the evaporation source device 10, and the evaporated material passes through the baffle opening during evaporation. 31 is evaporated on the surface of the substrate 4 . [0003] Such as figure 2 As shown, each baffle opening 31 is provided with a baffle opening cover 32 that can move (rotate) and cover the baf...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/24
CPCC23C14/24C23C14/044
Inventor 刘则
Owner BOE TECH GRP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com