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Light-emitting diode (LED) lamp

A technology of LED lamps and LED lamp groups, which is applied to lighting devices, cooling/heating devices of lighting devices, light sources, etc., can solve problems such as poor heat dissipation effect, and achieve the effect of high heat dissipation efficiency

Active Publication Date: 2014-02-12
HUBEI KAIMEI ENERGY TECH
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Problems solved by technology

[0003] In order to meet the illuminance requirements, LED lamps usually include multiple LEDs. The heat dissipation of these LEDs is the main factor affecting the use status and service life of LED lamps. Especially for high-power LED lamps, heat dissipation has become a technical bottleneck affecting their wide application.
[0004] In the prior art, a heat-conducting silicone pad is usually placed on the mounting surface of the LED, and the heat generated by the LED is dissipated in the air by heat conduction. The heat dissipation effect of this heat dissipation method is not good.

Method used

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  • Light-emitting diode (LED) lamp
  • Light-emitting diode (LED) lamp

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Embodiment Construction

[0024] In order to solve the technical problem of poor heat dissipation effect of existing LED lamps, the present invention provides an LED lamp with higher heat dissipation efficiency.

[0025] Such as figure 1 As shown, the LED lamp provided by an embodiment of the present invention includes: a heat sink 10 and an LED lamp group assembly 30, wherein,

[0026] The heat dissipation device 10 includes a base plate 11 and a cover plate 12, and the base plate 11 and the cover plate 12 are combined to form a sealed cavity having a liquid inlet 15 and a liquid outlet 16, and a cooling liquid is passed through the sealed cavity;

[0027] The LED lamp assembly 30 is fixed on the outer surface of the substrate 11.

[0028] The base plate 11 and the cover plate 12 should be made of materials with better heat conduction and insulation effects. The LED lamp assembly 30 can be fixedly connected to the substrate 11 by bolts. The LED lamp assembly 30 and the substrate 11 are in close-fitting contac...

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Abstract

The invention relates to the technical field of light-emitting diode (LED) lighting and discloses an LED lamp which comprises a radiating device and an LED lamp group assembly. The radiating device comprises a base plate and a cover plate which are in covering fit to form a sealing cavity with a liquid inlet and a liquid outlet, and cooling liquid is filled in the sealing cavity. The LED lamp group assembly is fixed on the outer surface of the base plate. Due to the fact that the cooling liquid is filled in the sealing cavity, heat generated by the LED lamp group assembly is transferred to the base plate, the base plate exchanges heat with the flowing cooling liquid, the heated cooling liquid is discharged from the liquid outlet, the heat generated by the LED lamp group assembly is quickly discharged to the outside of the device by the flowing cooling liquid, and the radiating efficiency is high.

Description

Technical field [0001] The invention relates to the technical field of LED lighting, in particular to an LED lamp. Background technique [0002] Against the background of the current global energy shortage, energy conservation is an important issue facing us in the future. In the field of lighting, the application of LED (light-emitting diode, LED) light-emitting products is attracting the attention of the world. A new type of green light source product is bound to be the main trend of future development. The 21st century will enter the era of a new type of lighting source represented by LEDs. [0003] In order to meet the illumination requirements, LED lamps usually include multiple LEDs. The heat dissipation of these LEDs is the main factor affecting the use status and service life of LED lamps. Especially for high-power LED lamps, the heat dissipation problem has become a technical bottleneck affecting its wide application. [0004] In the prior art, a thermally conductive silico...

Claims

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Application Information

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IPC IPC(8): F21S2/00F21V29/00F21Y101/02F21V29/56F21V29/58F21V29/76F21Y115/10
Inventor 李伟王宏志
Owner HUBEI KAIMEI ENERGY TECH
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