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Chip card module with separate antenna and chip card inlay using the same

A chip card and antenna technology, applied in the field of chip cards, can solve the problems of reducing the use of materials, reducing the package size of chip cards/antennas, etc.

Active Publication Date: 2017-10-13
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The interface between the antenna on package and the booster antenna depends on the footprint of the antenna, which may limit further reductions in the size of the chip card / antenna package
Therefore, it is also possible to limit further reductions in the use of materials in the protection of the chip package

Method used

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  • Chip card module with separate antenna and chip card inlay using the same
  • Chip card module with separate antenna and chip card inlay using the same
  • Chip card module with separate antenna and chip card inlay using the same

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Embodiment Construction

[0019] The following detailed description refers to the accompanying drawings that show, by way of illustration, specific details and aspects of the disclosure in which aspects of the disclosure may be practiced. These aspects of the disclosure are described in sufficient detail to enable those skilled in the art to practice them. Other aspects of the present disclosure may be utilized and structural, logical, and electrical changes may be made without departing from the scope of the present disclosure. The aspects of this disclosure are not necessarily mutually exclusive, as some aspects of this disclosure can be combined with one or more other aspects of this disclosure to form new aspects of this disclosure. Accordingly, the following detailed description is not to be taken in a limiting sense, and the scope of the present disclosure is defined by the appended claims.

[0020] Aspects of the present disclosure are provided for apparatuses, and aspects of the present disclo...

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PUM

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Abstract

The invention relates to a smart card module with a separate antenna and a smart card inlay using this module. A chip card module is disclosed. The module includes an antenna carrier defining an antenna layer having at least one antenna disposed on a surface of the antenna carrier. A chip package defines an encapsulation layer different from said antenna layer, wherein the chip package encloses an integrated circuit chip packaged separately from the antenna layer. The chip package is attached to the antenna carrier, and it is electrically connected to the antenna, forming a stacked structure.

Description

technical field [0001] Aspects of the present disclosure relate generally to chip card technology, and more particularly to chip card modules and antennas therefor. Background technique [0002] A smart card comprising a smart card module with an integrated antenna for smart card applications is designed such that the antenna is an integral part of the module. The advantage of this configuration can be that the smart card antenna for the wireless smart card does not require a mechanical connection to the package, but can be mounted on the package antenna without a direct connection between the package antenna and the booster antenna. The connection between the chip or the package and the card antenna is realized between the enhanced antenna. In this case, the interface between the packaged antenna and the enhanced antenna can be realized by adjusting the resonant interface between the antennas. Establishing this resonance may be a matter of the size and dimensions of the a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06K19/077H01Q1/22H01Q1/38
CPCH01Q1/38H01Q1/2225H01Q7/00H01Q9/27H01Q23/00Y10T29/49016
Inventor J.赫格尔F.皮施纳
Owner INFINEON TECH AG