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High power led module

A LED module, high-power technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems affecting the performance of chips and lamps, uneven temperature distribution, etc., to increase material costs, good heat dissipation effect, good temperature The effect of uniformity

Active Publication Date: 2017-04-19
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This uneven temperature distribution will affect the performance of chips and lamps

Method used

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Embodiment

[0026] Figure 5 It is a schematic diagram of the distribution of light-emitting chips in the circular arrangement of the high-power LED module in the embodiment of the present invention. The high-power LED module in this example is composed of a heat-dissipating substrate and a plurality of identical light-emitting chips. The difference from the high-power LED module in the prior art is that the light-emitting chips are evenly arranged in a rectangular or circular manner on the heat-dissipating substrate. In this example, a plurality of identical light-emitting chips are arranged on the heat dissipation substrate in an arrangement of sparse inside and dense outside. Here, the shape of the heat dissipation substrate can be square, polygonal or circular, and a plurality of light-emitting chips refers to at least 10 light-emitting chips. , the light-emitting chip can be arranged on the heat dissipation substrate in a manner of bonding with an adhesive material.

[0027] In this...

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Abstract

The invention relates to LED module technology. The present invention solves the problem of excessive temperature in the center of the substrate caused by the superimposed effect of power concentration and temperature field in the existing high-power LED module, and provides a high-power LED module. The technical solution can be summarized as: high-power The LED module includes a heat dissipation substrate and a plurality of light-emitting chips, each light-emitting chip is arranged on the heat dissipation substrate, and the plurality of identical light-emitting chips are arranged on the heat dissipation substrate in an arrangement of sparse inside and dense outside. The beneficial effect of the invention is that it has better temperature uniformity and better heat dissipation effect, and is suitable for high-power LED modules.

Description

technical field [0001] The invention relates to LED module technology, in particular to high-power LED modules. Background technique [0002] LED is a new type of semiconductor solid light source, which has the advantages of high safety and reliability, low power consumption, high luminous efficiency, strong applicability, good stability, short response time, changeable color, and environmental protection. It is widely used in lighting, display and other fields. [0003] When the power of the LED lamp is high, if the heat generated cannot be dissipated in a timely and effective manner, the PN junction temperature of the light-emitting chip will rise, thereby accelerating the aging of the chip and packaging resin, and may also cause the solder joints to melt and cause the chip to fail. And then directly affect the service life and luminous efficiency of LED. How to enhance heat dissipation and reduce chip temperature has become the focus of the industry. A common solution ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/64H01L33/48H01L25/075
CPCH01L25/0753
Inventor 王向展邹淅黄建国赵迪陈南庭欧文张衡明
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA