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Film-shaped circuit connecting material and circuit connecting structure

A circuit connection material and electrical connection technology, applied in the direction of structural connection, conductive connection, and electrical component connection of printed circuits, can solve the problems of reduced adhesion and peeling of film-like circuit connection materials, to ensure visibility, reduce Effect of connecting resistors

Inactive Publication Date: 2014-02-19
HITACHI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] When insulating particles are dispersed in the adhesive component, the adhesive force of the film-like circuit connecting

Method used

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  • Film-shaped circuit connecting material and circuit connecting structure
  • Film-shaped circuit connecting material and circuit connecting structure
  • Film-shaped circuit connecting material and circuit connecting structure

Examples

Experimental program
Comparison scheme
Effect test

Example

[0126] (Example 1)

[0127] 400 parts by mass of polycaprolactone diol with a weight average molecular weight of 800, 131 parts by mass of 2-hydroxypropyl acrylate, 0.5 parts by mass of dibutyltin dilaurate as a catalyst, and 1.0 parts by mass of hydroquinone monomethyl ether as a polymerization inhibitor The parts are heated to 50°C and mixed while stirring. Next, 222 parts by mass of isophorone diisocyanate was dropped, and the temperature was further increased to 80° C. while stirring to perform a polyurethane reaction. After confirming that the reaction rate of the isocyanate group was 99% or more, the reaction temperature was lowered to obtain a urethane acrylate.

[0128] Using terephthalic acid as a dicarboxylic acid, propylene glycol as a diol, and 4,4'-diphenylmethane diisocyanate as an isocyanate to prepare terephthalic acid / propylene glycol / 4,4'-diphenylmethane diisocyanate A polyester polyurethane resin A having an isocyanate molar ratio of 1.0 / 1.3 / 0.25.

[0129] Next,...

Example

[0132] (Examples 2-16)

[0133] Such as Figure 5 Except that the average particle diameter of the conductive particles, the number of conductive particles, the type of dye, the amount of dye, and the thickness of the film-like circuit connection material were changed as shown, the same operation as in Example 1 was carried out to produce a film-like circuit connection material.

Example

[0134] (Examples 17, 18)

[0135] 25 parts by mass of the above-mentioned urethane acrylate as a radical polymerizable substance, 20 parts by mass of isocyanurate-type acrylate (product name: M-325, manufactured by Toagosei Co., Ltd.), and 2-methacryloyloxyethyl 1 part by mass of base acid phosphate (product name: P-2M) and 4 parts by mass of benzoyl peroxide (product name: Nyper-BMT-K40) as a free radical generator and as a film-forming polymer 55 parts by mass of a 20% by mass methyl ethyl ketone solution of polyester polyurethane resin A was mixed, and 0.5 parts by mass of black dye (product name: NUBIAN BLACK, manufactured by ORIENT Industry Co., Ltd.) was further dispersed and stirred to obtain an adhesive Components of the binder resin solution.

[0136] Furthermore, conductive particles (average particle diameter: 3 μm) having an outermost layer containing Ni and having polystyrene particles as a core body and a coated core body and having protrusions formed on the surface ...

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Abstract

Disclosed is a film-shaped circuit connecting material including: an adhesive component having an adhesive layer placed between opposing circuit electrodes and used in order to electrically connect the circuit electrodes, the adhesive layer containing (a) a thermoplastic resin, (b) a hardening substance, (c) a hardening agent, and (d) a dye; and electrically conductive particles each having a plastic core and a metal layer covering the plastic core, the outermost layer of the metal layer being formed by plating including at least one substance selected from among Ni, Ni alloys, and Ni oxides, and the average particle size being 2.0 to 3.5 µm.

Description

technical field [0001] The present invention relates to a film-like circuit connection material and a circuit connection structure. Background technique [0002] Conventionally, an anisotropic conductive adhesive film is known as a film-shaped circuit connecting material interposed between opposing circuit electrodes and used for electrically connecting electrodes in a direction of application of heat and pressure. For example, an anisotropic conductive adhesive film obtained by dispersing conductive particles in an epoxy-based adhesive or an acrylic adhesive is known. Such an anisotropic conductive adhesive film is widely used to electrically connect a TCP (Tape Carrier Package) or COF (Chip On Flex) mounted with a semiconductor that drives a liquid crystal display (hereinafter referred to as "LCD") to an LCD panel. , or electrically connect the TCP or COF to the printed wiring board. [0003] Recently, when semiconductors are mounted face-down directly on LCD panels and ...

Claims

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Application Information

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IPC IPC(8): H01R11/01C09J9/02C09J175/04C09J201/00H01B5/16H05K1/14H05K3/32
CPCC08G18/7671C08G18/4213C08G18/755C08G18/672H05K2201/0221C09J175/06H05K3/361H01R4/04H05K3/323C09J9/02C09J11/00C08K9/02C08J2363/00C08J2425/08C08J2433/24C08L75/16C08G18/4277H01R11/01H01B5/16H05K1/14C08K3/00
Inventor 立泽贵藤绳贡松田和也小林隆伸久米雅英工藤直
Owner HITACHI CHEM CO LTD
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