Film-shaped circuit connecting material and circuit connecting structure

A circuit connection material and electrical connection technology, applied in the direction of structural connection, conductive connection, and electrical component connection of printed circuits, can solve the problems of reduced adhesion and peeling of film-like circuit connection materials, to ensure visibility, reduce Effect of connecting resistors
CN103597667AInactive Publication Date: 2014-02-19HITACHI CHEM CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
HITACHI CHEM CO LTD
Publication Date
2014-02-19
Estimated Expiration
Not applicable · inactive patent

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Abstract

Disclosed is a film-shaped circuit connecting material including: an adhesive component having an adhesive layer placed between opposing circuit electrodes and used in order to electrically connect the circuit electrodes, the adhesive layer containing (a) a thermoplastic resin, (b) a hardening substance, (c) a hardening agent, and (d) a dye; and electrically conductive particles each having a plastic core and a metal layer covering the plastic core, the outermost layer of the metal layer being formed by plating including at least one substance selected from among Ni, Ni alloys, and Ni oxides, and the average particle size being 2.0 to 3.5 µm.
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Description

technical field

[0001] The present invention relates to a film-like circuit connection material and a circuit connection structure. Background technique

[0002] Conventionally, an anisotropic conductive adhesive film is known as a film-shaped circuit connecting material interposed between opposing circuit electrodes and used for electrically connecting electrodes in a direction of application of heat and pressure. For example, an anisotropic conductive adhesive film obtained by dispersing conductive particles in an epoxy-based adhesive or an acrylic adhesive is known. Such an anisotropic conductive adhesive film is widely used to electrically connect a TCP (Tape Carrier Package) or COF (Chip On Flex) mounted with a semiconductor that drives a liquid crystal display (hereinafter referred to as "LCD") to an LCD panel. , or electrically connect the TCP or COF to the printed wiring board.

[0003] Recently, when semiconductors are mounted face-down directly on LCD panels and ...

Claims

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