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MEMS microphone making method

A manufacturing method and microphone technology, which is applied in the field of acoustics and electricity, can solve the problems of high work intensity of assembly workers, cumbersome production and processing technology, and complicated microphone structure, and achieve the effects of solving cumbersome assembly process, improving acoustic performance, and simplifying the assembly process

Inactive Publication Date: 2014-02-26
GOERTEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For the three-layer circuit board packaging structure, when assembling, the three-layer circuit boards need to be assembled one by one. The production and processing technology is relatively cumbersome, and the structure of the MEMS microphone is also relatively complicated. Not only the work intensity of the assembly workers is high, but the production efficiency also low

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A method for manufacturing a MEMS microphone, comprising the following steps:

[0026] S1. A first circuit board is provided. The shape and size of this circuit board are consistent with the shape and size of a single MEMS microphone. A groove is processed on this circuit board by a milling machine. Then, a shielding layer is provided on the surface of the groove or the outer surface of the first circuit board for shielding the electromagnetic signal outside the MEMS microphone. This step of setting the shielding layer can also be performed after step S2.

[0027] S2. A second circuit board is provided, and the shape and size of the second circuit board are consistent with those of the first circuit board.

[0028] S3. Fix the MEMS chip on the bottom of the groove of the first circuit board or the position corresponding to the groove of the second circuit board, and open a sound hole on the circuit board with the MEMS chip fixed on the position corresponding to the inne...

Embodiment 2

[0034] A method for manufacturing a MEMS microphone, comprising the following steps:

[0035] S1. A first circuit board is provided, and at least two grooves are machined on the same side of the circuit board by a milling machine. Then, a shielding layer is provided on the surface of each groove for shielding the electromagnetic signal outside the MEMS microphone, and the process of providing the shielding layer can also be performed after step S2.

[0036] S2. A second circuit board is provided, and the shape and size of the second circuit board are consistent with those of the first circuit board.

[0037] S3. The bottom of each groove on the first circuit board or the position corresponding to each groove on the second circuit board are respectively fixed with MEMS chips, and each MEMS chip is fixed on the circuit board with the MEMS chip fixed. A sound hole is opened at the position of the inner cavity of the chip.

[0038] S4. Coating a conductive fixing material on the...

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Abstract

The invention discloses an MEMS microphone making method and belongs to the electroacoustic technology field. The MEMS microphone making method comprises steps that: S1, a first circuit board is provided, and at least one groove is arranged on the first circuit board; S2, a second circuit board is provided, a shape and dimensions of the second circuit board are in matching with those of the first circuit board; S3, each groove of the first circuit board or each position on the second circuit board corresponding to one groove is provided with an MEMS chip; S4, one side end face of the first circuit board which is provided with the grooves is coated with a conductive fixing material; and S5, the first circuit board and the second circuit board are packaged into one body through the conductive fixing material, and each MEMS chip is respectively arranged in a sound chamber enclosed by the corresponding groove and the second circuit board, and thereby a packaging body is formed. Assembly technology and a structure of an MEMS microphone are simplified.

Description

technical field [0001] The invention relates to the field of acoustic and electric technologies, in particular to a method for manufacturing a MEMS microphone. Background technique [0002] MEMS microphones are energy converters that convert sound signals into electrical signals. With the rapid development of electronic technology in recent years, MEMS microphones have also been widely used in portable electronic devices. [0003] At present, MEMS microphones mainly have two structures: one is an external packaging structure composed of a metal shell and a circuit board; the other is a pure circuit board packaging structure, which is composed of two upper and lower circuit boards and Surrounded by a circuit board with an acoustic cavity in the middle, this structure is called a three-layer circuit board package structure. For the three-layer circuit board packaging structure, when assembling, the three-layer circuit boards need to be assembled one by one. The production and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R31/00
Inventor 李欣亮王顺刘瑞宝
Owner GOERTEK INC