Method and system for measuring parameters of round holes in plate

Abstract

The invention provides a method and a system for measuring parameters of round holes in a plate. The method comprises the following steps: obtaining inner and outer parameters of a multi-view camera; performing image acquisition on the plate by utilizing the multi-view camera to obtain a local plane grey image of the plate; obtaining pixel values of characteristic parameters of linear segment end points and the round holes in the plate according to the local plane grey image; determining local space parameters of the round holes in each pair of binocular camera coordinate systems according to the pixel values of the characteristic parameters of the round holes in the local plane grey image and the inner and outer parameters of the multi-view camera; switching and concatenating the local space parameters of the round holes in each pair of binocular camera coordinate systems through the inner and outer parameters of the multi-view camera, and determining overall space information of the round holes in the plate. According to the scheme, the measurement precision and the completeness of the holes in the plate are improved, the measurement speed of the holes in the plate is increased, and the measurement cost of the holes in the plate is reduced.

Description

technical field [0001] The invention relates to the field of measurement technology, in particular to a method and system for measuring parameters of round holes on a plate. Background technique [0002] In recent years, plate-shaped parts have become one of the important parts in current electromechanical products, and are widely used in aviation, aerospace, automobile, shipbuilding and other industrial fields. Round holes are the most important features on plate parts, and are usually used to position and connect plates. On large-sized boards, round holes often have the characteristics of large number, wide distribution, and inconsistent sizes. The processing accuracy directly determines the performance of the part. With the continuous advancement of industrial technology, people have put forward higher and higher requirements for the accuracy and efficiency of part feature measurement. Due to the wide application of round holes in industrial parts, the rapid and accurat...

AI Technical Summary

Problems solved by technology

[0012] The technical problem to be solved by the present invention is to provide a method and system for measuring the parameters of round holes on boards, which solves the problem of contact-type round-hole measurement methods based on mechanical devices and non-contact round-hole measurement based on universal tool microscopes in the prior art. The method is cumbersome and complicated, low efficiency, high cost, etc., and the simple binocular vision solution measures the spatial position information of large-size plate circular holes with incomplete information and low accuracy.

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