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Pattern forming device and pattern forming method

A pattern and film technology, applied in the field of pattern forming devices and pattern formation, can solve the problems of large number of processes, consumption, and increased product cost

Inactive Publication Date: 2014-03-12
JTEKT CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, since the mask covering the workpiece needs to be replaced for each process, the conventional method has the problem of consuming a large number of steps and increasing the product cost.

Method used

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  • Pattern forming device and pattern forming method
  • Pattern forming device and pattern forming method
  • Pattern forming device and pattern forming method

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Embodiment Construction

[0021] Embodiments of the present invention will be described below based on the drawings. figure 1 It is a perspective view which shows the schematic structure of the pattern forming apparatus of this invention. This pattern forming device forms different types of films on a plurality of regions of the surface F of the workpiece W by electrodeposition, and obtains a predetermined film pattern from these films. However, the reason why such a film is formed on the surface of the workpiece W is, for example, to improve the wear resistance of the surface or to reduce frictional resistance. Moreover, the reason for providing the film pattern which has several kinds of films is to change the characteristic for every area|region of the surface F.

[0022] Figure 5 It is an explanatory view of the surface F of the workpiece W on which a predetermined film pattern is obtained by using the pattern forming apparatus of the present embodiment. In the present embodiment, the workpiec...

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Abstract

A pattern forming device includes a plurality of tanks, and a power supply device. Each of the tanks has an open end having the same shape as a profile shape of a corresponding one of regions of a surface of a workpiece, in which different types of films are to be formed, and stores a corresponding one of electrodeposition solutions used to form the different types of films in a state where the open end is in contact with the surface. The power supply device applies a predetermined voltage to between the workpiece that serves as a first electrode, and each one of second electrodes in the tanks.

Description

technical field [0001] This application refers to the entire contents of the specification, claims, drawings, and abstract disclosed in Japanese Patent Application No. 2012-183261 filed on August 22, 2012. [0002] The present invention relates to a pattern forming device and a pattern forming method for forming different kinds of films on a plurality of regions on the surface of a workpiece by electrodeposition, and using these films to obtain a predetermined film pattern on the surface of the workpiece. Background technique [0003] For example, in order to reduce the frictional resistance on the surface of a metal workpiece, a resin film is sometimes formed on the surface. Electrodeposition is known as a method for forming such a film. That is, if Figure 7 As shown, by arranging a workpiece 92 and a counter electrode 93 in a water tank 91 containing an electrodeposition solution (electrolyte solution) 90 containing a resin component, and applying a DC voltage to them, t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/02
CPCC25D5/02C25D17/004C25D17/12C25D17/00C25D17/02C25D13/22
Inventor 博伊科·斯托伊梅诺夫山川和芳铃木雅裕松尾和昭
Owner JTEKT CORP