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Press for preventing test piece from moving in pressing and splicing process

A test piece and bonding technology, which is applied in the field of test piece pressure bonding machinery, can solve problems such as difficult sample quality and bonding failure, and achieve the effects of improving bonding quality and efficiency, convenient operation and simple structure.

Inactive Publication Date: 2014-03-19
CHENGDU ENGINE GROUP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing press has only one indenter, which can only apply pressure on the overlapping section (bonding part) of the two test pieces, so it is difficult to avoid the displacement of the two test pieces when the adhesive is not cured, so that the bonding position and bonding area Altered, resulting in bond failure
Especially for samples that require high-temperature heating and curing adhesives, it is even more difficult to ensure the quality of the samples

Method used

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  • Press for preventing test piece from moving in pressing and splicing process
  • Press for preventing test piece from moving in pressing and splicing process
  • Press for preventing test piece from moving in pressing and splicing process

Examples

Experimental program
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Effect test

Embodiment Construction

[0023] The press for preventing the test piece from moving during pressure bonding according to the present invention will be further described below through embodiments and in conjunction with the drawings.

[0024] In this embodiment, the press that prevents the test piece from moving when pressure is applied is such as figure 1 , figure 2 As shown, it consists of a base 1, a main pressing device and two auxiliary pressing devices 10.

[0025] The base 1 is a stepped rectangular plate with a flat bottom surface and two different height surfaces. The higher top surface is used to install the main pressure device and two auxiliary pressure devices, and the lower top surface is used for Place the test piece.

[0026] The main pressure device consists of a support 2, a lever 6, a weight 7, a main pressure head 3, a spring 4 and a force transmission block 5. The support 2 is provided with five pairs of hinge shaft mounting holes 8 of different heights, and the spring 4 is Cylindrical...

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Abstract

The invention provides a press for preventing a test piece from moving in a pressing and splicing process. The press comprises a base, a main pressing device and two auxiliary pressing devices, wherein the main pressing device is mounted on the base; the central line of the main pressing device is parallel to the central line of the base; the central line of the main pressing device and the central line of the base are on the same vertical plane; the two auxiliary pressing devices are symmetrically mounted on the two sides of the main pressing device. The main pressing device is composed of a support, a lever, a weight, a main pressing head, a spring and a force transmission block; the two auxiliary pressing devices are the same in structure; each auxiliary pressing device is composed of a rocker arm, a stud, an auxiliary pressing head, a bracket, a first connection sheet and a second connection sheet.

Description

Technical field [0001] The invention belongs to the field of test piece pressure bonding machinery, and particularly relates to a press which can prevent the test piece from moving during pressure bonding. Background technique [0002] Adhesive shear strength samples such as Figure 4 As shown, it is formed by bonding two test pieces, the two test pieces are overlapped, and the overlapped sections are integrated by adhesive glue. The adhesive shear strength sample is prepared by coating the overlapping section of two test pieces with adhesive, and then curing the adhesive under pressure. The existing press has only one indenter, which can only apply pressure on the overlapping section (bonding part) of the two test pieces, so it is difficult to avoid the displacement of the two test pieces when the adhesive is not yet cured, so that the bonding position and bonding area Change occurred, causing bonding failure. Especially for samples that require high-temperature heating to cure...

Claims

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Application Information

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IPC IPC(8): B32B37/10B32B37/12
Inventor 李德川刘建穆俊宏
Owner CHENGDU ENGINE GROUP
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