A kind of manufacturing method of aluminum base circuit board
A production method and circuit board technology, which are applied in the directions of printed circuit manufacturing, printed circuits, electrical components, etc., can solve the problems of difficulty in controlling the flow of low-flow glue PP, affecting the process of circuit board gongs and grooves, and difficult quality control, so as to save the process. Cost, simple operation, and the effect of ensuring product quality
Inactive Publication Date: 2016-05-25
广东达进电子科技有限公司
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Problems solved by technology
[0002] The production of circuit boards involves many processes, including the lamination process. When laminating, low-flow glue PP is generally used. Low-flow glue PP is a prepreg, which is easy to melt when heated, and low-flow glue PP is used. A certain flow of glue overflows, it is difficult to control the flow of low-flow glue PP, resulting in the flow to the designated area that is not allowed, and the use of low-flow glue PP affects the gong groove process of the circuit board. Therefore, low-flow glue PP is used when making circuit boards. The cost is relatively high, and the quality is difficult to control
Method used
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Embodiment Construction
[0037] Embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0038] A method for manufacturing an aluminum-based circuit board of the present invention comprises the following steps:
[0039] 1) Make the inner core board
[0040] (1) Cutting: cutting according to the design size of the inner core board;
[0041] (2) Paste dry film: Paste dry film on the front of each layer of inner layer core board of (1) step;
[0042] (3) Inner layer graphic transfer: the inner layer graphic on the film sheet is transferred to the dry film of step (2);
[0043] (4) pattern etching: according to the inner pattern of step (3), etch with etching potion, obtain corresponding circuit;
[0044] (5) Remove the dry film: remove all the dry film on the step (4), so that the copper surface and the circuit are exposed;
[0045] (6) Graphic inspection: scan and check the circuit of step (5) with AOI;
[0046] (7) Paste the pure rubbe...
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The invention discloses a manufacturing method of an aluminum-based circuit board. During a manufacturing process, a pure glue film is plastered in advance on an inner layer core plate and a light plate, a tool hole is bored, a groove is milled, and during stitching, riveting with the aluminum-based circuit board is realized by direct use of a rivet. The operation is simple, the problem of the overflow of the pure glue film in the stitching process is effectively avoided, the flow of the pure glue film is easily controlled, the product quality is ensured, and the process cost is saved.
Description
【Technical field】 [0001] The invention relates to a method for manufacturing a circuit board, in particular to a method for manufacturing an aluminum-based circuit board. 【Background technique】 [0002] The production of circuit boards involves many processes, including the lamination process. When laminating, low-flow glue PP is generally used. Low-flow glue PP is a prepreg, which is easy to melt when heated, and low-flow glue PP is used. A certain flow of glue overflows, it is difficult to control the flow of low-flow glue PP, resulting in the flow to the designated area that is not allowed, and the use of low-flow glue PP affects the gong groove process of the circuit board. Therefore, low-flow glue PP is used when making circuit boards. The cost is relatively high, and the quality is difficult to control. 【Content of invention】 [0003] The technical problem to be solved by the present invention is to provide a manufacturing method of an aluminum-based circuit board. ...
Claims
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IPC IPC(8): H05K3/00
Inventor 陈华巍谢兴龙姚超
Owner 广东达进电子科技有限公司