Silicon wafer multi-wire cutting machine diamond wire cutting fluid system
A technology of diamond wire cutting and multi-wire cutting machines, which is applied to working accessories, fine working devices, stone processing equipment, etc., and can solve problems such as high wire speed, equipment damage, and high heat
Active Publication Date: 2016-03-09
GCL POLY ENERGY HLDG
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Problems solved by technology
Therefore, the cutting fluid system of traditional free multi-wire cutting equipment directly adopts diamond wire cutting, and there will be the following problems: the diamond wire cutting feed is fast, the wire speed is high, and the heat generated during the cutting process is large, which cannot meet the cooling effect; and diamond wire cutting When cutting, the silicon powder produced by cutting is easy to adhere to the equipment, causing damage to the equipment, etc.
Method used
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[0016] Please refer to figure 1 , this embodiment discloses a silicon wafer multi-wire cutting machine diamond wire cutting fluid system 100, including a cutting machine 110 provided with a diamond wire 111 for cutting silicon ingots 200, a supply device 120 for supplying cutting fluid to the cutting machine 110, and a recycling cutting machine. A recovery device 130 for the cutting fluid flowing down from the machine 110.
[0017] The supply device 120 includes a cutting nozzle 121 arranged on one side of the diamond wire 111 and providing cutting fluid for cutting, a cooling nozzle 122 arranged on the other side of the diamond wire 111 providing cutting fluid for cooling and cleaning, and controlling the cutting nozzle 121 and the cooling nozzle 122 respectively. Several supply valves 123 for the flow rate, a supply pump 124 connected to the supply valve 123 , and a supply cylinder 125 connected to the supply pump 124 .
[0018] The recovery device 130 includes a return cyl...
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The invention discloses a silicon wafer multi-wire cutting machine diamond wire cutting liquid system which comprises a cutting machine, a feeding device and a recovery device. The cutting machine is provided with a diamond wire cutting a silicon ingot, the feeding device provides cutting liquid for the cutting machine, and the recovery device recycles the cutting liquid flowing from the cutting machine. The feeding device comprises a cutting nozzle, a cooling nozzle, a plurality of feeding valves, a feeding pump and a feeding cylinder, the feeding valves control the flow of the cutting nozzle and the flow of the cooling nozzle respectively, the feeding pump is connected with the feeding valves, and the feeding cylinder is connected with the feeding pump. The recovery device comprises a flow-back cylinder with a precipitation function and a draw-off pump connected with the feeding cylinder. The cooling nozzle is arranged on one side of the diamond wire and independently controlled through the feeding valves, a large amount of the cutting liquid can be sprayed out to achieve the cooling and washing function, the flow-back cylinder in the recovery device has the function of precipitating silica powder in the cutting liquid for repeated use, and therefore the silicon wafer multi-wire cutting machine diamond wire cutting liquid system suitable for diamond wire cutting is formed.
Description
technical field [0001] The invention relates to the field of multi-wire cutting of silicon wafers, in particular to a diamond wire cutting fluid system for a multi-wire cutting machine of silicon wafers. Background technique [0002] Solar-grade cell silicon wafers are cut from silicon blocks or rods by a multi-wire cutting machine. According to the development trend of the current industry, diamond wire multi-wire cutting technology will become the mainstream of multi-wire cutting in the future. The cutting fluid system of traditional free multi-wire cutting equipment adopts the mixed solution of silicon carbide powder for cutting. The cutting principle is that the mixed solution of silicon carbide attached to the steel wire is driven by the steel wire to complete the cutting of the silicon rod. The cutting fluid needs to be mixed evenly and has a high viscosity, and at the same time, a high flow rate is required to meet a certain cutting capacity. When using diamond wire...
Claims
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IPC IPC(8): B28D5/04B28D7/02
Inventor 张强
Owner GCL POLY ENERGY HLDG