One-time etch first and then plate metal frame subtractive embedded chip front-mount bump structure and process method

Abstract

The invention relates to a one-time eroding-before-plating metal frame subtraction embedded chip normally-arranged salient point structure and a technological method. The one-time eroding-before-plating metal frame subtraction embedded chip normally-arranged salient point structure is characterized in that a metal substrate frame is included, a paddle and pins are arranged in the metal substrate frame, the pins are of a step shape, the front face of the paddle and the front faces of the pins are aligned with the front face of the metal substrate frame, the back faces of the pins are aligned with the back face of the metal substrate frame, the back face of the paddle is aligned with the step faces of the pins, metal layers are arranged on the step faces of the pins, a chip is arranged on the back face of the paddle through conducting or non-conducting adhesion substances, the front face of the chip is connected with the surfaces of the metal layers on the step faces of the pins through metal wires, plastic packaging materials wrap the paddle, the pins, the chip and the metal wires, and anti oxidation layers are plated on or organic solderability preservative (OSP) wraps the front face of the paddle, the front faces and the back faces of the pins and the surface of the metal substrate frame. Metal balls are arranged on the back faces of the pins. The one-time eroding-before-plating metal frame subtraction embedded chip normally-arranged salient point structure has the advantages of being capable of solving the problem that the function and the application performance of a metal wire frame are restricted due to the fact that objects cannot be buried in the thickness of the traditional metal wire frame.

Description

Technical field [0001] The invention relates to a structure and a process method for a front mounting bump structure of a chip with a subtraction method of etched and then plated with a metal frame. It belongs to the field of semiconductor packaging technology. Background technique [0002] There are two main traditional four-sided flat leadless metal lead frame structures: [0003] One is a four-sided flat no-lead package (QFN) lead frame. The lead frame of this structure is composed of a copper metal frame and a high temperature resistant adhesive film (such as Figure 16 Shown). [0004] One is the pre-encapsulated four-sided flat no-lead package (pQFN) lead frame. The lead frame structure of this structure includes the lead and the base island. The etching area between the lead and the base island is filled with a plastic compound (such as Figure 17 Shown). [0005] The above-mentioned traditional metal lead frame has the following disadvantages: [0006] 1. The traditional metal ...

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to overcome the above-mentioned disadvantages, and to provide a bump structure and process method of one-time etching and then metal-plated metal frame subtraction embedded chips, which can solve the problem of lack of system functions in traditional metal lead frames

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