42results about How to "Reach packaging technology capability" patented technology

The invention relates to a secondary plating-prior-to-etching metal frame subtraction imbedded chip flip flat pin structure and a process method. The structure comprises a metal substrate fame (1). The metal substrate fame (1) is internally provided with base islands (2) and pins (3). The pins (3) are in step shapes. The back surface of each base island (2) is flush with the step surface of each pin (3). The back surface of each base island (2) and the step surface of each pin (3) are invertedly equipped with a chip (6) through bottom filling glue (5). The metal substrate fame (1) is internally filled with plastic packaging material (7). The front surface of the plastic packaging material (7) is flush with the step surface of the pin (3). The back surface of the plastic packaging material (7) is flush with the back surface of the metal substrate fame (1). The front surface of the base island (2), the front surface and the back surface of each pin (3) as well as the front surface and the back surface of the metal substrate fame (1) are provided with an anti-oxidation layer (4). The beneficial effect of the structure and method is that: the problem that the function and the application performance of a conventional metal lead frame are limited since an object cannot be imbedded in the metal lead frame with such plate thickness is solved.

The invention relates to a flip-chip three-dimensional system-level metal circuit board structure and a process method thereof. The structure includes a metal substrate frame, and base islands and pins are arranged in the metal substrate frame. Chips are flipped on the front of the base island and the pins, conductive pillars are arranged on the front of the pins, the area around the base island, the area between the base island and the pins, and the area between the pins , the base island and the upper part of the pin, the base island and the lower part of the pin, and the outside of the chip and the conductive pillar are all encapsulated with plastic compound, and the surface of the metal substrate frame, pin and conductive pillar exposed to the plastic compound is plated with Antioxidant layer. The invention can solve the problem that the traditional metal lead frame cannot be embedded in objects and limits the functionality and application performance of the metal lead frame.

The invention relates to a secondary plating-prior-to-etching metal frame subtraction imbedded chip flip bump structure and a process method. The structure comprises a metal substrate fame (1). The metal substrate fame (1) is internally provided with base islands (2) and pins (3). The pins (3) are in step shapes. The back surface of each base island (2) is flush with the step surface of each pin (3). The back surface of each base island (2) and the step surface of each pin (3) are invertedly equipped with a chip (6) through bottom filling glue (5). The metal substrate fame (1) is internally filled with plastic packaging material (7). The front surface of the plastic packaging material (7) is flush with the step surface of the pin (3). The back surface of the plastic packaging material (7) is flush with the back surface of the metal substrate fame (1). The front surface of the base island (2), the front surface and the back surface of each pin (3) as well as the front surface and the back surface of the metal substrate fame (1) are provided with an anti-oxidation layer (4). The back surface of each pin (3) is provided with a metal ball (9). The beneficial effect of the structure and method is that: the problem that the function and the application performance of a conventional metal lead frame are limited since an object cannot be imbedded in the metal lead frame with such plate thickness is solved.

The invention relates to a secondary first-corrosion-then-plating metal frame subtraction burying chip obverse-mounting flat foot structure and technology method. The structure comprises a metal base plate frame (1), a base island (2) and a pin (3) are arranged in the metal base plate frame (1), the pin (3) is in a step shape, the back face of the base island (2) and the step face of the pin (3) are flush, a metal layer (4) is arranged on the step face of the pin (3), a chip (6) is arranged on the back face of the base island (2) in an obverse mode, the surface of the chip (6) and the surface of the metal layer (4) are connected through a metal wire (7), the inner zone of the metal base plate frame (1) is filled with moulding compounds (8), the front face of the moulding compounds (8) is flush with the step face of the pin (3), the back face of the moulding compounds (8) is flush with the back face of the metal base plate frame (1), and anti-oxidation layers (9) are arranged on the front face of the base island (2), the front face and the back face of the pin (3) and the front face and the back face of the metal base plate frame (1). The structure has the advantages that the problem that an object cannot be buried into plate thickness of a traditional metal lead frame, so that the function and the application performance of the metal lead frame are limited can be solved.

The invention relates to a three-dimensional system-level metal circuit board structure and process method for sealing first and then etching passive devices. The structure includes a metal substrate frame (1), and pins (3) are arranged on the front of the metal substrate frame (1) , the front of the pin (3) is provided with a conductive pillar (4), and a passive device (5) is installed between the pin (3) and the pin (3) through a conductive or non-conductive bonding substance (11) ), the peripheral areas of the pins (3), conductive pillars (4) and passive components (5) are encapsulated with a molding compound (7), and the molding compound (7) is flush with the top of the conductive pillars (4), An anti-oxidation layer (6) is provided on the surface of the metal substrate frame (1), pins (3) and conductive pillars (4) exposed from the molding compound (7). A three-dimensional system-level metal circuit board structure and process method for sealing first and etching later passive devices, which can solve the problem that the traditional metal lead frame cannot be embedded in objects and limit the functionality and application performance of the metal lead frame.

The invention relates to a primary plating-prior-to-etching metal frame subtraction imbedded chip normal-installation bump structure and a process method. The structure is characterized in that the structure comprises a metal base frame; the metal base frame is internally provided with base islands and pins; the pins are in step shapes; the front surface of each base island and the front surface of each pin are flush with the front surface of the metal substrate frame; the back surface of each pin is flush with the back surface of the metal substrate frame; the step surface of each pin is provided with a metal layer; the back surface of each base island is provided with a chip through a conductive or non-conductive bonding material; the front surface of the chip is connected with the surface of the metal layer through a metal line; the front surface of the base island, the front surface and the back surface of each pin as well as the surface of the metal substrate frame are plated with an anti-oxidation layer or a coated antioxidant (OSP), wherein plastic packaging materials are flush with the anti-oxidation layers or the coated antioxidants (OSP) on the upper and lower surfaces of the metal substrate frame; and the back surface of each pin is provided with a metal ball. The beneficial effect of the structure and method is that: the problem that the function and the application performance of a conventional metal lead frame are limited since an object cannot be imbedded in the metal lead frame of such plate thickness is solved.

The invention relates to a one-time eroding-before-plating metal frame subtraction embedded chip normally-arranged salient point structure and a technological method. The one-time eroding-before-plating metal frame subtraction embedded chip normally-arranged salient point structure is characterized in that a metal substrate frame is included, a paddle and pins are arranged in the metal substrate frame, the pins are of a step shape, the front face of the paddle and the front faces of the pins are aligned with the front face of the metal substrate frame, the back faces of the pins are aligned with the back face of the metal substrate frame, the back face of the paddle is aligned with the step faces of the pins, metal layers are arranged on the step faces of the pins, a chip is arranged on the back face of the paddle through conducting or non-conducting adhesion substances, the front face of the chip is connected with the surfaces of the metal layers on the step faces of the pins through metal wires, plastic packaging materials wrap the paddle, the pins, the chip and the metal wires, and anti oxidation layers are plated on or organic solderability preservative (OSP) wraps the front face of the paddle, the front faces and the back faces of the pins and the surface of the metal substrate frame. Metal balls are arranged on the back faces of the pins. The one-time eroding-before-plating metal frame subtraction embedded chip normally-arranged salient point structure has the advantages of being capable of solving the problem that the function and the application performance of a metal wire frame are restricted due to the fact that objects cannot be buried in the thickness of the traditional metal wire frame.

The invention relates to a primary plating-prior-to-etching metal frame subtraction imbedded chip flip plat pin structure and a process method. The primary plating-prior-to-etching metal frame subtraction imbedded chip flip plat pin structure is characterized in that the structure comprises a metal base frame; the metal base frame is internally provided with base islands and pins; the back surface of each base island and the step surface of each pin are invertedly provided with a chip through bottom filling glue; the peripheral areas of the base islands, the areas between the base islands and the pins, the areas between the pins, the areas above the base islands and the pins, the areas under the base islands and the pins and the outer sides of the chips are wrapped with plastic packaging materials; and the front surface of the base island, the front surface and the back surface of each pin as well as the surface of the metal substrate fame are plated with an anti-oxidation layer or a coated antioxidant (OSP), wherein the plastic packaging materials are flush with the anti-oxidation layers or coated antioxidants (OSP) on the upper and lower surfaces of the metal substrate fame. The beneficial effect of the structure and method is that: the problem that the function and the application performance of a conventional metal lead frame are limited since an object cannot be imbedded in the metal lead frame of such plate thickness is solved.

The invention relates to a packaging-prior-to-etching chip-normally-bonded bump type three-dimensional system-level metal circuit board and a process method thereof. The metal circuit board structurally comprises a metal substrate frame (1), wherein pins (3) are arranged in the metal substrate frame (1); conductive columns (4) are arranged on the front surfaces of the pins (3); a chip (5) is normally bonded on the front surface of the metal substrate frame (1) or between each two pins (3); the front surfaces of the chips (5) and the pins (3) are connected through metal wires (6); molding compounds (8) are encapsulated in the peripheral areas of the pins (3), the conductive columns (4), the chips (5) and the metal wires (6); anti-oxidation layers (7) are arranged on the surfaces, exposed from the molding compounds (8), of the metal substrate frame (1), the pins (3) and the conductive columns (4); and metal balls (16) are arranged on the tops of the conductive columns (4). The packaging-prior-to-etching chip-normally-bonded bump type three-dimensional system-level metal circuit board and the process method thereof have the beneficial effect that the problem of limitation of the functionality and application performance of a metal lead frame caused by difficulty in embedding of an object into a conventional metal lead frame can be solved.

The invention relates to a primary plating-prior-to-etching metal frame subtraction imbedded chip normal-installation flat pin structure and a process method. The structure comprises a metal substrate frame. The metal substrate frame is internally provided with base islands and pins. The pins are in step shapes. The front surface of each base island and the front surface of each pin are flush with the front surface of the metal substrate frame. The back surface of each pin is flush with the back surface of the metal substrate frame. The back surface of each base island is flush with the step surface of each pin. The step surface of each pin is provided with a metal layer. The back surface of each base island is provided with a chip through conductive or non-conductive bonding material. The front surface of the chip is connected with the surface of the metal layer on the step surface of each pin through a metal line. The front surface of the base island, the front surface and the back surface of each pin as well as the surface of the metal substrate frame are plated with an anti-oxidation layer or a coated antioxidant (OSP), wherein plastic packaging materials are flush with the anti-oxidation layers or coated antioxidants (OSP) on the upper and lower surfaces of the metal substrate frame. The beneficial effect of the structure and method is that: the problem that the function and the application performance of a conventional metal lead frame are limited since an object cannot be imbedded in the metal lead frame of such plate thickness is solved.