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Packaging-prior-to-etching passive device type three-dimensional system-level metal circuit board structure and process method thereof

A technology of passive devices and metal circuits, which is applied in the fields of electric solid-state devices, semiconductor devices, semiconductor/solid-state device manufacturing, etc., and can solve the problems of limiting the functionality and application performance of metal lead frames

Active Publication Date: 2013-11-20
江阴芯智联电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] The purpose of the present invention is to overcome the above-mentioned deficiencies, and provide a three-dimensional system-level metal circuit board structure and process method for passive devices that are sealed first and etched later. application performance

Method used

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  • Packaging-prior-to-etching passive device type three-dimensional system-level metal circuit board structure and process method thereof
  • Packaging-prior-to-etching passive device type three-dimensional system-level metal circuit board structure and process method thereof
  • Packaging-prior-to-etching passive device type three-dimensional system-level metal circuit board structure and process method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0202] Example 1: single-layer circuit single-turn pin (1)

[0203] see Figure 18 , the present invention is a three-dimensional system-level metal circuit board structure for sealing first and then etching passive devices. Conductive pillars 4 are provided, and passive devices 5 are installed on the front of the base island 2 and pins 3 through conductive or non-conductive adhesive substances 11, and the base island 2, pins 3, conductive pillars 4 and passive devices 5 The peripheral area is encapsulated with molding compound or epoxy resin 7, and the molding compound or epoxy resin 7 is flush with the top of the conductive pillar 4, and the metal substrate frame 1, base island 2, pins 3 and conductive pillar 4 are exposed from the plastic package. The surface of the material or epoxy resin 7 is provided with an anti-oxidation layer 6.

[0204] Its process method is as follows:

[0205] Step 1. Take the metal substrate

[0206] see figure 1 , take a piece of metal subs...

Embodiment 2

[0239] Example 2: single-layer circuit single-turn pin (2)

[0240] see Figure 39 , the present invention is a three-dimensional system-level metal circuit board structure for sealing first and then etching passive devices. Conductive pillars 4 are provided, and passive devices 5 are installed on the front of the base island 2 and pins 3 through conductive or non-conductive adhesive substances 11, the base island 2, pins 3, conductive pillars 4, and passive devices 5 The peripheral area is encapsulated with molding compound or epoxy resin 7, the molding compound or epoxy resin 7 is flush with the top of the conductive pillar 4, and the base island 2 and the back of the pin 3 are provided with a highly conductive metal layer 8, so Green paint or photosensitive non-conductive adhesive material 9 is filled between the highly conductive metal layer 8 and the high conductive metal layer 8, and the metal substrate frame 1, conductive pillars 4 and high conductive metal layer 8 are...

Embodiment 3

[0283] Example 3: Multi-layer circuit single-turn pin

[0284] see Figure 81 , the present invention is a three-dimensional system-level metal circuit board structure for sealing first and then etching passive devices. Conductive pillars 4 are provided, and passive devices 5 are installed on the front of the base island 2 and pins 3 through conductive or non-conductive adhesive substances 11, and the base island 2, pins 3, conductive pillars 4 and passive devices 5 The peripheral area is encapsulated with molding compound or epoxy resin 7, and the molding compound or epoxy resin 7 is flush with the top of the conductive pillar 4, and the metal substrate frame 1, base island 2, pin 3 and conductive pillar 4 are exposed from the plastic package. The surface of the material or epoxy resin 7 is provided with an anti-oxidation layer 6.

[0285] The difference between embodiment 3 and embodiment 1 is that: both the base island 2 and the pin 3 are composed of multiple layers of me...

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Abstract

The invention relates to a packaging-prior-to-etching passive device type three-dimensional system-level metal circuit board structure and a process method thereof. The structure comprises a metal substrate frame (1), wherein pins (3) are arranged on the front surface of the metal substrate frame (1); conductive columns (4) are arranged on the front surfaces of the pins (3); a passive device (5) is arranged between each two pins (3) through a conductive or non-conductive adhesion material (11); molding compounds (7) are encapsulated in the peripheral areas of the pins (3), the conductive columns (4) and the passive devices (5) and are level with the tops of the conductive columns (4); and anti-oxidation layers (6) are arranged on the surfaces, exposed from the molding compounds (7), of the metal substrate frame (1), the pins (3) and the conductive columns (4). By virtue of the packaging-prior-to-etching passive device type three-dimensional system-level metal circuit board structure and the process method thereof, the problem of limitation of the functionality and application performance of a metal lead frame caused by difficulty in embedding of an object into a conventional metal lead frame can be solved.

Description

technical field [0001] The invention relates to a three-dimensional system-level metal circuit board structure and process method of sealing first and then etching passive devices, belonging to the technical field of semiconductor packaging. Background technique [0002] The basic manufacturing process methods of traditional metal lead frames are as follows: [0003] 1. Take a metal sheet and use the technology of mechanical upper and lower tool punching to make punching from top to bottom or bottom to top in a longitudinal manner (see Figure 85 ), so that the lead frame can be formed in the metal sheet with the base island carrying the chip and the inner pins for signal transmission and the outer pins connected to the external PCB, and then the inner pins and / or some areas of the base island Metallization coating to form a real usable leadframe (see Figure 86 , 87 ); [0004] 2. Take a metal sheet and use chemical etching technology for exposure, development, window op...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H01L21/56H01L23/495H01L23/31
CPCH01L2924/19107H01L2224/16225H01L2224/16245H01L2224/48091H01L2224/49171H01L2224/73204H01L2924/00014
Inventor 梁新夫梁志忠林煜斌王亚琴张友海
Owner 江阴芯智联电子科技有限公司
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